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Xilinx XC2V500-5FG256I

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 589824 256-BGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC2V500-5FG256I

Datasheet: XC2V500-5FG256I Datasheet (PDF)

Package/Case: BGA256

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2944 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC2V500-5FG256I General Description

Virtex®-II Field Programmable Gate Array (FPGA) IC 172 589824 256-BGA

xc2v500-5fg256i

Features

  • It has 500,000 system gates and 7,056 logic cells.
  • It has 34,560 bits of block RAM and 1,152 kilobits of distributed RAM.
  • It supports a maximum clock frequency of 308 MHz.
  • It has 384 input/output pins.
  • It has 256 pins in a Fine-pitch Ball Grid Array (FBGA) package.

Application

  • Video processing and display
  • High-speed networking and communication systems
  • Digital signal processing (DSP)
  • Medical imaging
  • Aerospace and defense applications
  • Automotive systems
  • Industrial automation
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Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
Product: Virtex-II Number of I/Os: 172 I/O
Operating Supply Voltage: 1.5 V Minimum Operating Temperature: - 40 C
Maximum Operating Temperature: + 100 C Mounting Style: SMD/SMT
Package / Case: FBGA-256 Series: XC2V500
Brand: Xilinx Number of Gates: 500000
Distributed RAM: 96 kbit Embedded Block RAM - EBR: 576 kbit
Product Type: FPGA - Field Programmable Gate Array Subcategory: Programmable Logic ICs
Tradename: Virtex

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC2V500-5FG256I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC2V500-5FG676C

Brands :  

Package :  

Description :  

Part Number :   XC2V500-5FG676I

Brands :  

Package :  

Description :  

Part Number :   XC2V500-5FGG456C

Brands :  

Package :   BGA-456

Description :   500000 SYSTEM GATE 1.5 VOLT FPGA

Part Number :   XC2V500-5FGG456I

Brands :  

Package :   456-BBGA

Description :   500000 SYSTEM GATE 1.5 VOLT FPGA

Part Number :   XC2V500-5FGG676C

Brands :  

Package :  

Description :  

Part Number :   XC2V500-5FGG676I

Brands :  

Package :  

Description :  

Part Number :   XC2V500-5FGG896C

Brands :  

Package :  

Description :  

Part Number :   XC2V500-5FGG896I

Brands :  

Package :  

Description :  

Part points

  • The XC2V500-5FG256I chip is a programmable logic device manufactured by Xilinx. It belongs to the Virtex-II family and has 500,000 system gates. The "-5" refers to its speed grade, while "FG256I" stands for fine-pitch grid array with 256 pins. This chip offers high-performance, low-power consumption, and reconfigurability, making it suitable for a variety of applications in the fields of telecommunications, industrial automation, and more.
  • Equivalent

    The equivalent products of the XC2V500-5FG256I chip are XCV1000E-6FG1156C, XCV200E-7BG352I, XCV400E-6HQ240C, and XCV600E-6HQ240I from the Xilinx Virtex-II FPGA family.
  • Features

    The XC2V500-5FG256I is a programmable logic device (PLD) with 500,000 system gates, 264 user I/Os, and 2,880 logic cells. It has a 5V input/output voltage and operates at a clock frequency of up to 133 MHz. It is designed for high-performance applications in various industries such as aerospace, defense, and industrial automation.
  • Pinout

    The XC2V500-5FG256I is an FPGA with a pin count of 256 and speed grade 5. It offers 3.3V logic, 1.5V core, and has various functions such as configurable logic blocks, input/output blocks, memory blocks, and embedded multipliers for versatile design implementations.
  • Manufacturer

    The manufacturer of the XC2V500-5FG256I is Xilinx Inc. It is a multinational technology company that specializes in developing and manufacturing programmable logic devices and associated software tools. Xilinx is known for its field-programmable gate array (FPGA) and programmable logic solutions used across various industries including aerospace, defense, automotive, and telecommunications.
  • Application Field

    The XC2V500-5FG256I is a Field-Programmable Gate Array (FPGA) that can be used in a variety of application areas such as telecommunications, aerospace and defense, industrial automation, and medical imaging. It offers high performance and flexibility for implementing complex systems and algorithms.
  • Package

    The XC2V500-5FG256I chip is packaged in a 256-ball BGA (Ball Grid Array) package type, with a form factor that conforms to the FG (Fine Grain) architecture. The size of the chip is within the industry standard for BGA packages.

Datasheet PDF

Preliminary Specification XC2V500-5FG256I PDF Download

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