Xilinx XC2S300E-6FGG456C

Part points

• The XC2S300E-6FGG456C is a programmable logic device (PLD) chip from Xilinx. It is equipped with 300,000 system gates and operates at a speed grade of -6. The chip features 456 ball grid array (BGA) packages and is designed for advanced digital applications. With its high programmability, it enables users to configure logic functions and interconnections according to their specific requirements.

• Equivalent

  There are no direct equivalent products for the XC2S300E-6FGG456C chip. However, the closest alternatives would be other Xilinx Spartan-II FPGAs, such as the XC2S200E or XC2S400E, with similar features but potentially different specifications and pin configurations.

• Features

  The XC2S300E-6FGG456C is a Xilinx Spartan-2E FPGA with 300K system gates, advanced digital signal processing (DSP) capabilities, and an embedded hard PowerPC 405 processor. It operates at -6 speed grade and comes in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package. It offers versatile programmable logic and high-speed performance for a wide range of applications.

• Pinout

  The XC2S300E-6FGG456C has a pin count of 456. It is a field-programmable gate array (FPGA) and its main function is to perform digital logic functions, including data processing, communication, and control tasks within electronic systems.

• Manufacturer

  The manufacturer of the XC2S300E-6FGG456C is Xilinx Inc. Xilinx is an American technology company that designs and develops programmable logic devices and associated software tools. They are known for their field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs), which are used in a variety of industries including telecommunications, automotive, aerospace, and defense.

• Application Field

  The XC2S300E-6FGG456C is a field-programmable gate array (FPGA) designed for various applications including telecommunications, automotive, industrial control, and consumer electronics. It provides high-speed processing, flexibility, and scalability, making it suitable for a wide range of tasks such as signal processing, data encryption, image processing, and system modeling.

• Package

  The XC2S300E-6FGG456C chip is a Field Programmable Gate Array (FPGA) available in a 456-pin Fine-pitch Ball Grid Array (FBGA) package. The package size is 27 mm x 27 mm and has a 1 mm ball pitch.