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K4T1G164QF-BCE7

1Gb F-die DDR2 SDRAM

ISO14001 ISO9001 DUNS

Brands: SAMSUNG

Mfr.Part #: K4T1G164QF-BCE7

Datasheet: K4T1G164QF-BCE7 Datasheet (PDF)

Package/Case: FPBGA84

Product Type: Memory chips

RoHS Status:

Stock Condition: 387 pcs, New Original

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Quick Quote

Please submit RFQ for K4T1G164QF-BCE7 or email to us: Email: [email protected], we will contact you within 12 hours.

Ovaga has a large stock of K4T1G164QF-BCE7 Memory chips from SAMSUNG and we guarantee that they are original,brand new parts sourced directly from SAMSUNG We can provide quality testing reports for K4T1G164QF-BCE7 upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.

K4T1G164QF-BCE7
K4T1G164QF-BCE7

Specifications

Parameter Value Parameter Value
Pin Count 84 Package Category BGA
Released Date Feb 6, 2022

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • K4T1G164QF-BCE7 is a DDR3 SDRAM chip manufactured by Samsung. It has a capacity of 1GB and a speed of 1333MHz. The chip is commonly used in laptops, desktops, and other computing devices for its reliable performance and efficiency.
  • Equivalent

    Some equivalent products of the K4T1G164QF-BCE7 chip include: 1. Micron MT47H64M16HR-25E:H 2. Hynix H5TC4G63CFR-PBA 3. Samsung K4A8G085WB-BCRC These chips are all DDR4 SDRAM modules with similar specifications and performance characteristics.
  • Features

    - DDR2 SDRAM module - 16Gb capacity - 4 banks - Burst length of 4, 8 - CAS latency of 7, 6 - Clock speeds of 800MHz, 667MHz
  • Pinout

    The K4T1G164QF-BCE7 is a 128Mb DDR SDRAM chip with a 66-pin TSOP II package. It has a 16-bit data bus, operates at a voltage of 2.5V, and has a speed of 266 MHz. The pinout includes DQ, DQS, BA, A, VDD, VSS, and CLK signals for data input/output, addressing, power, and clocking.
  • Manufacturer

    Samsung is the manufacturer of the K4T1G164QF-BCE7. Samsung is a South Korean multinational conglomerate company known for its electronics, particularly in the semiconductor industry. They are one of the largest manufacturers of memory chips and have a significant presence in various other industries such as smartphones, televisions, and appliances.
  • Application Field

    The K4T1G164QF-BCE7 memory module is commonly used in applications such as consumer electronics, digital cameras, tablets, and laptops. It is also utilized in networking equipment, automotive electronics, and industrial automation systems where high-performance and reliable memory storage is required.
  • Package

    The K4T1G164QF-BCE7 chip is a DDR2 SDRAM chip that comes in a 60-ball FBGA package. It has a form factor of 8M x 16 and a size of 1Gbit.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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