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K4B2G1646F-BYK0
DRAM Chip DDR3L SDRAM 2Gbit 128Mx16 1.35V/1.5V 96-Pin FBGA
Brands: SAMUNG/MICRON
Mfr.Part #: K4B2G1646F-BYK0
Datasheet: K4B2G1646F-BYK0 Datasheet (PDF)
Package/Case: FBGA96
Product Type: DRAM Chip
Ovaga has a large stock of K4B2G1646F-BYK0 DRAM Chip from SAMUNG/MICRON and we guarantee that they are original,brand new parts sourced directly from SAMUNG/MICRON We can provide quality testing reports for K4B2G1646F-BYK0 upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| ECCN (US) | EAR99 | Part Status | Obsolete |
| Automotive | No | PPAP | No |
| DRAM Type | DDR3L SDRAM | Chip Density (bit) | 2G |
| Organization | 128Mx16 | Number of Internal Banks | 8 |
| Number of Words per Bank | 16M | Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 | Maximum Clock Rate (MHz) | 1600 |
| Maximum Access Time (ns) | 0.225 | Address Bus Width (bit) | 17 |
| Minimum Operating Supply Voltage (V) | 1.283|1.425 | Typical Operating Supply Voltage (V) | 1.35|1.5 |
| Maximum Operating Supply Voltage (V) | 1.45|1.575 | Operating Current (mA) | 118 |
| Minimum Operating Temperature (°C) | 0 | Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Commercial | Number of I/O Lines (bit) | 16 |
| Mounting | Surface Mount | Package Height | 0.73 |
| Package Width | 7.5 | Package Length | 13.3 |
| PCB changed | 96 | Standard Package Name | BGA |
| Supplier Package | FBGA | Pin Count | 96 |
| Lead Shape | Ball |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The K4B2G1646F-BYK0 chip is a high-performance 2Gb DDR3 SDRAM chip designed for use in various electronic devices, including computers and mobile devices. It features fast data transfer speeds, low power consumption, and reliable performance.
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Equivalent
Some alternative products to the K4B2G1646F-BYK0 chip include: K4B2G1646G-BYK0, K4B2G1646F-BYJ0, K4B2G1646Q-BYK0, and K4B2G1646H-BYK0. These chips have similar specifications and performance capabilities, making them suitable replacements for the K4B2G1646F-BYK0 in various applications. -
Features
- DDR4 SDRAM with 4Gb density - Speed of up to 2400Mbps - Low operating voltage of 1.2V - 78-ball FBGA package - Internal banks for concurrent operation - On-die termination for better signal integrity - RoHS compliant -
Pinout
The K4B2G1646F-BYK0 is a DDR3 SDRAM with a 96-ball FBGA package. It has a 13x9 ball array with a pitch of 0.8mm and a ball size of 0.6mm. The functions of the pins include power supply, address/command inputs, data inputs/outputs, clocks, and a reset pin. -
Manufacturer
The manufacturer of the K4B2G1646F-BYK0 is Samsung Electronics. Samsung Electronics is a South Korean multinational corporation that specializes in the manufacture of electronics such as smartphones, televisions, and memory components. The company is one of the largest manufacturers of memory chips in the world. -
Application Field
The K4B2G1646F-BYK0 is commonly used in various electronic devices such as smartphones, tablets, digital cameras, and other portable electronic devices. It is also used in networking equipment, servers, and automotive systems to provide high-speed and reliable memory storage capabilities for efficient performance.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
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