K4B4G1646E-BCNB
DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 96-Pin FBGA
Brands: SAMSUNG SEMICONDUCTOR INC
Mfr.Part #: K4B4G1646E-BCNB
Datasheet: K4B4G1646E-BCNB Datasheet (PDF)
Package/Case: FBGA
RoHS Status:
Stock Condition: 6554 pcs, New Original
Product Type: DRAMs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $5.187 | $5.187 |
10 | $4.570 | $45.700 |
30 | $4.202 | $126.060 |
100 | $3.830 | $383.000 |
500 | $3.658 | $1829.000 |
1120 | $3.581 | $4010.720 |
In Stock:6554 PCS
Ovaga has a large stock of K4B4G1646E-BCNB DRAMs from SAMSUNG SEMICONDUCTOR INC and we guarantee that they are original,brand new parts sourced directly from SAMSUNG SEMICONDUCTOR INC We can provide quality testing reports for K4B4G1646E-BCNB upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.
Specifications
Parameter | Value | Parameter | Value |
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Rohs Code | Yes | Part Life Cycle Code | Active |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | Package Description | FBGA-96 |
Reach Compliance Code | ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | Samacsys Manufacturer | SAMSUNG |
Access Mode | MULTI BANK PAGE BURST | Access Time-Max | 0.255 ns |
Additional Feature | AUTO/SELF REFRESH | Clock Frequency-Max (fCLK) | 1066 MHz |
I/O Type | COMMON | Interleaved Burst Length | 4,8 |
JESD-30 Code | R-PBGA-B96 | Length | 13.3 mm |
Memory Density | 4294967296 bit | Memory IC Type | DDR3 DRAM |
Memory Width | 16 | Number of Functions | 1 |
Number of Ports | 1 | Number of Terminals | 96 |
Number of Words | 268435456 words | Number of Words Code | 256000000 |
Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 95 °C |
Operating Temperature-Min | Organization | 256MX16 | |
Output Characteristics | 3-STATE | Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA | Package Equivalence Code | BGA96,9X16,32 |
Package Shape | RECTANGULAR | Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
Self Refresh | YES | Sequential Burst Length | 4,8 |
Standby Current-Max | 0.000015 A | Supply Current-Max | 0.2 mA |
Supply Voltage-Max (Vsup) | 1.575 V | Supply Voltage-Min (Vsup) | 1.425 V |
Supply Voltage-Nom (Vsup) | 1.5 V | Surface Mount | YES |
Technology | CMOS | Terminal Form | BALL |
Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
Width | 7.5 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The K4B4G1646E-BCNB chip is a type of dynamic random-access memory (DRAM) used in computer systems. It has a capacity of 4 gigabits (4 Gb) and operates at a speed of 1600 megabits per second (1600 Mbps). This chip is commonly used in various electronic devices to provide fast and efficient data storage and retrieval capabilities.
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Features
The K4B4G1646E-BCNB is a 4Gb DDR3L SDRAM that operates at a maximum frequency of 1600 MHz. It has a voltage range of 1.35V and a low power consumption profile. This memory module is suitable for applications that require high performance and low energy consumption. -
Pinout
The K4B4G1646E-BCNB is a DDR4 SDRAM chip with a 96-pin BGA (Ball Grid Array) package. It has a pin count of 96 and is used for high-speed data transfer in computer memory modules. -
Manufacturer
Samsung is the manufacturer of the K4B4G1646E-BCNB. Samsung is a multinational conglomerate company that specializes in various industries, including electronics, telecommunications, and information technology. -
Application Field
The K4B4G1646E-BCNB is a 4Gb DDR4 SDRAM component with a 512Mx8bit configuration. It can be used in various applications such as servers, workstations, desktop PCs, laptops, gaming consoles, networking devices, and embedded systems. -
Package
The package type of the K4B4G1646E-BCNB chip is FBGA (Fine-Pitch Ball Grid Array). The form is 78-ball. The chip size is defined by the JEDEC standard as 8mm x 10mm.
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products