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Ovaga Certification

Brands: Elite Semiconductor Memory Technology Inc

Mfr.Part #: F59L1G81LA-25TG2Y

Datasheet: F59L1G81LA-25TG2Y Datasheet (PDF)

Package/Case: TSOP-48

Product Type: Memory

RoHS Status:

Stock Condition: 3589 pcs, New Original

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Quick Quote

Please submit RFQ for F59L1G81LA-25TG2Y or email to us: Email: [email protected], we will contact you within 12 hours.

Ovaga has a large stock of F59L1G81LA-25TG2Y Memory from Elite Semiconductor Memory Technology Inc and we guarantee that they are original,brand new parts sourced directly from Elite Semiconductor Memory Technology Inc We can provide quality testing reports for F59L1G81LA-25TG2Y upon your request. To obtain a quote, simply fill in the required quantity, contact name, and email address in the quick quote form on the right. Our sales representative will contact you within 12 hours.



Parameter Value Parameter Value
Density 1Gbit Organization 128M x 8
Speed 25ns Voltage - Supply 2.7 V ~ 3.6 V
Operating Temperature -40°C ~ 85°C


Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.


Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US$0.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.


1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.


  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Key points

  • F59L1G81LA-25TG2Y is a chip used in electronic devices for storing data. It has a memory capacity of 1 Gb (gigabit) and operates at a speed of 25 ns (nanoseconds). The chip is designed to be used with a dual voltage supply, allowing for better performance and efficiency. It is commonly used in applications such as smartphones, tablets, and other computing devices.
  • Features

    The F59L1G81LA-25TG2Y is a 1 Gb SDR SDRAM chip with 8 banks and 4 bits pre-fetch architecture. It operates at a voltage of 2.5V and provides a maximum clock frequency of 166 MHz. It supports burst read and burst write operations, as well as page access mode.
  • Pinout

    The F59L1G81LA-25TG2Y is a 512Mb SDRAM with a pin count of 96. It features a synchronous interface and operates at a speed of 250 MHz.
  • Manufacturer

    The manufacturer of the F59L1G81LA-25TG2Y is Samsung Electronics. Samsung Electronics is a multinational electronics company based in South Korea. It specializes in the production of various consumer electronics, such as smartphones, televisions, home appliances, and memory chips like the F59L1G81LA-25TG2Y.
  • Application Field

    The F59L1G81LA-25TG2Y is a NAND Flash memory chip commonly used in various electronic devices, including smartphones, tablets, digital cameras, solid-state drives (SSDs), and other portable devices. It is designed to provide high-density storage and fast data access, making it suitable for applications that require reliable and high-performance data storage solutions.
  • Package

    The F59L1G81LA-25TG2Y chip has a BGA package type, with a form factor of 11.0 mm x 13.0 mm, and a size of 143 square mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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