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K4B2G1646C-HCH9
Brands: SAMSUNG
Mfr.Part #: K4B2G1646C-HCH9
Datasheet: K4B2G1646C-HCH9 Datasheet (PDF)
Package/Case: FBGA-96
Product Type: Memory chips
K4B2G1646C-HCH9 General Description
The 2Gb DDR3 SDRAM C-die is organized as a 16Mbit x 16 I/Os x 8 banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 2133Mb/sec/pin (DDR3-2133) for general applications.
Features
- - K4B2G1646C-HCH9 is an 8 Gigabit (1 Gigabyte) DDR3 Synchronous DRAM chip.
- - It operates at a voltage of 1.5V.
- - The chip has a 1.6 Gbps (gigabits per second) data transfer rate.
- - It uses a FBGA (Fine-pitch Ball Grid Array) package type.
Application
- - This DRAM chip is commonly used in various electronic devices that require fast and reliable memory storage, such as laptops, desktop computers, servers, and gaming consoles.
- - It can also be found in smartphones, tablets, and other portable devices where low power consumption is crucial.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Name | K4B2G1646C-HCH9 | Product Type | Memory |
| Manufacturer | Samsung Electronics | Memory Type | DDR3 SDRAM |
| Memory Size | 2GB | Number of Bits | 4G x 16 |
| Speed | DDR3-1600 | Memory Interface | Parallel |
| Supply Voltage | 1.425V - 1.575V | Operating Temperature | 0°C ~ 85°C |
| Mounting Type | Surface Mount | Package / Case | 96-TFBGA |
| Memory Organization | 512M x 4 | Memory Clock Frequency | 800MHz |
| Data Rate | 1600MT/s |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the K4B2G1646C-HCH9 component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : K4B2G1646C-HCH9
Brands :
Package : FBGA-96
Description : There might not be direct equivalent parts numbers for the K4B2G1646C-HCH9, as it is a specific model made by Samsung. However, other manufacturers may produce similar DRAM chips with comparable specifications. It is recommended to consult the datasheets and specifications from different manufacturers to find suitable alternatives.
Part points
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The K4B2G1646C-HCH9 is a DDR3 SDRAM chip manufactured by Samsung. It has a capacity of 2Gb, operates at 1.35V, and has a data transfer rate of 1866Mbps. This chip is commonly used in computer systems, servers, and other electronic devices that require high-speed memory.
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Equivalent
Some equivalent products of the K4B2G1646C-HCH9 chip are Micron MT41K512M16HA-125:E and SK Hynix H5TC4G63AFR-PBA. These chips have similar specifications and can be used as alternatives in certain applications. -
Features
- DDR4 SDRAM - 4Gb density - x16 organization - 1.2V power supply - High-speed operation up to 2400 MHz - Enhanced power-saving features - RoHS compliant - JEDEC standard compliance -
Pinout
The K4B2G1646C-HCH9 is a 96-ball FBGA package with a pin count of 78. It is a DDR3L SDRAM chip with a capacity of 2 Gbit and operates at a voltage of 1.35V. The function of this chip is to provide high-speed and high-density memory storage for various electronic devices. -
Manufacturer
Samsung is the manufacturer of the K4B2G1646C-HCH9. It is a South Korean multinational conglomerate corporation primarily known for its consumer electronics products, such as smartphones, TVs, and home appliances. Samsung also produces a variety of other products, including memory chips like the K4B2G1646C-HCH9 used in various electronic devices. -
Application Field
The K4B2G1646C-HCH9 is commonly used in various devices and applications such as smartphones, tablets, laptops, gaming consoles, and automotive infotainment systems. It is ideal for high-performance computing applications, graphics-intensive tasks, and multitasking operations due to its high storage capacity and fast data transfer speeds. -
Package
The K4B2G1646C-HCH9 chip comes in a 78-ball FBGA package, with a form factor of 9mm x 13mm and a size of 4Gb (512MB).
We provide high quality products, thoughtful service and after sale guarantee
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We have rich products, can meet your various needs.
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Minimum order quantity starts from 1pcs.
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Lowest international shipping fee starts from $0.00
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365 days quality guarantee for all products
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