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H5TQ4G63MFR-PBC
DDR DRAM, 256MX16, 0.225ns, CMOS
Brands: Sk Hynix Inc
Mfr.Part #: H5TQ4G63MFR-PBC
Datasheet: H5TQ4G63MFR-PBC Datasheet (PDF)
Package/Case: FBGA-96
Product Type: power semiconductor devices
RoHS Status:
Stock Condition: 5419 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomH5TQ4G63MFR-PBC General Description
H5TQ4G63MFR-PBC is a high-performance mobile DRAM module manufactured by SK Hynix. It is a 4-gigabit LPDDR4X SDRAM chip that is primarily used in smartphones, tablets, and other mobile devices requiring high-speed memory. The chip has a data rate of 4266 Mbps and operates at a voltage of 1.1V, making it energy-efficient and suitable for portable devices. It has a burst length of 8 and operates on a programmable CAS latency of 17, providing fast and reliable data access.The H5TQ4G63MFR-PBC module comes in a 96-ball FBGA package with a dimension of 11.5mm x 13mm, making it compact and suitable for small form factor devices. It has a temperature range of -25°C to 85°C, ensuring stable performance in both hot and cold conditions.
Features
Application
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Rohs Code | Yes | Part Life Cycle Code | Obsolete |
| Ihs Manufacturer | SK HYNIX INC | Part Package Code | BGA |
| Package Description | TFBGA, BGA96,9X16,32 | Pin Count | 96 |
| Reach Compliance Code | compliant | ECCN Code | EAR99 |
| HTS Code | 8542.32.00.36 | Access Mode | MULTI BANK PAGE BURST |
| Access Time-Max | 0.225 ns | Additional Feature | AUTO/SELF REFRESH |
| Clock Frequency-Max (fCLK) | 800 MHz | I/O Type | COMMON |
| Interleaved Burst Length | 4,8 | JESD-30 Code | R-PBGA-B96 |
| JESD-609 Code | e1 | Length | 13 mm |
| Memory Density | 4294967296 bit | Memory IC Type | DDR3 DRAM |
| Memory Width | 16 | Number of Functions | 1 |
| Number of Ports | 1 | Number of Terminals | 96 |
| Number of Words | 268435456 words | Number of Words Code | 256000000 |
| Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
| Organization | 256MX16 | Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY | Package Code | TFBGA |
| Package Equivalence Code | BGA96,9X16,32 | Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | Peak Reflow Temperature (Cel) | 260 |
| Power Supplies | 1.5 V | Qualification Status | Not Qualified |
| Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
| Self Refresh | YES | Sequential Burst Length | 4,8 |
| Standby Current-Max | 0.02 A | Supply Current-Max | 0.29 mA |
| Supply Voltage-Max (Vsup) | 1.575 V | Supply Voltage-Min (Vsup) | 1.425 V |
| Supply Voltage-Nom (Vsup) | 1.5 V | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | Terminal Form | BALL |
| Terminal Pitch | 0.8 mm | Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 20 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The H5TQ4G63MFR-PBC chip is a high-performance memory module commonly used in mobile devices such as smartphones and tablets. It offers fast data storage and retrieval capabilities, making it ideal for applications that require high-speed processing. With a compact form factor and reliable performance, it is a popular choice for manufacturers looking to improve the performance of their devices.
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Equivalent
Some equivalent products of the H5TQ4G63MFR-PBC chip are the MT47H64M16HR-25E:H, K4F4E304HB-MGCH, and AS4C128M16D3L-12BCN. These chips all have similar specifications and features, making them suitable alternatives for the H5TQ4G63MFR-PBC chip in various applications. -
Features
H5TQ4G63MFR-PBC is a high-speed, low-power DDR4 SDRAM memory module. It boasts a capacity of 4GB and operates at a speed of 3200 Mbps. With a compact form factor and high data transfer rates, it is ideal for use in various computing and mobile devices. -
Pinout
The H5TQ4G63MFR-PBC is a 144-pin mobile DRAM chip that features 4Gb of memory. The pin count refers to the number of physical pins on the chip for connecting to a circuit board, while the function is to provide high-speed random access memory for mobile devices. -
Manufacturer
The manufacturer of the H5TQ4G63MFR-PBC is SK Hynix. SK Hynix is a South Korean multinational corporation that specializes in the production of memory semiconductors, including DRAM, NAND Flash, and CMOS Image Sensors. Founded in 1983, SK Hynix is one of the largest memory chip makers in the world and serves a wide range of industries, including consumer electronics, telecommunications, and automotive. -
Application Field
The H5TQ4G63MFR-PBC is commonly used in mobile devices such as smartphones and tablets for high-performance memory storage and data processing. It is also suitable for use in automotive applications, industrial devices, and other embedded systems that require fast and reliable memory performance in a compact form factor. -
Package
The H5TQ4G63MFR-PBC chip is a 64-Gigabit (4 Gigabyte) DDR3 SDRAM manufactured by Hynix. It comes in a 96-ball FBGA package and has a form factor of 13.5mm x 21.5mm. The chip size is 4GB.
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