Images are for reference only See Product Specifications
H5DU2562GTR-E3C
16MX16 DDR SDRAM TSOP 2.6V 400MHZ
Brands: SKHYNIX
Mfr.Part #: H5DU2562GTR-E3C
Datasheet: H5DU2562GTR-E3C Datasheet (PDF)
Package/Case: TSOP66
Product Type: Memory
RoHS Status:
Stock Condition: 7326 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
Add To BomH5DU2562GTR-E3C General Description
DESCRIPTION The H5DU2562GFR is a 268,435,456-bit CMOS Double Data Rate(DDR) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density and high bandwidth.FEATURES •VDD, VDDQ= 2.5V +/- 0.2V • All inputs and outputs are compatible with SSTL_2 interface • Fully differential clock inputs (CK, /CK) operation • Double data rate interface • Source synchronous - data transaction aligned to bidirectional data strobe (DQS) • x16 device has two bytewide data strobes (UDQS, LDQS) per each x8 I/O • Data outputs on DQS edges when read (edged DQ) Data inputs on DQS centers when write (centered DQ) • On chip DLL align DQ and DQS transition with CK transition • DM mask write data-in at the both rising and falling edges of the data strobe • All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock • Programmable CAS latency 2/2.5 (DDR200, 266, 333), 3 (DDR400) and 4 (DDR500) supported • Programmable burst length 2/4/8 with both sequential and interleave mode • Internal four bank operations with single pulsed/RAS • Auto refresh and self refresh supported • tRAS lock out function supported • 8192 refresh cycles/64ms •60 Ball FBGA Package Type • This product is in compliance with the directive pertaining of RoHS.
Features
- 1. It has a capacity of 256 Megabits (Mb).
- 2. The device operates at a voltage of 2.5V.
- 3. It is organized as 4M words x 4 bits x 4 banks.
- 4. The module utilizes a double data rate (DDR) interface for high-speed data transfers.
- 5. It operates at a clock frequency of 166 MHz.
Application
- 1. H5DU2562GTR-E3C is commonly used in computer systems as main memory (RAM).
- 2. It can be found in various computing devices such as desktops, laptops, servers, and workstations.
- 3. It can also be used in networking equipment, telecommunications devices, and industrial applications where reliable and high-speed memory is required.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer | HYNIX |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
-
![Product]( "Product")
Step1 :Product
-
![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
-
![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
-
![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
-
![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
-
![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
-
The H5DU2562GTR-E3C chip is a high-speed synchronous dynamic random access memory (SDRAM) module designed for use in networking, telecommunications, and other high-performance applications. It offers a large capacity of 256 megabits and operates at a high frequency for fast data access and transfer speeds.
-
Equivalent
Equivalent products of H5DU2562GTR-E3C chip are H5DU2562GTR-E3I, H5DU2562GTR-E3C, H5DU2562GTR-E3C, and H5DU2562GTR-E3I. These products are all 256Mb GDDR3 SDRAM chips with a 5ns access time, suitable for high-performance computing applications. -
Features
1. 256Mb density 2. 166MHz clock rate 3. 2.5V power supply 4. Burst length of 2, 4, or 8 5. Burst read with masking 6. Auto precharge 7. 4K refresh with hidden refresh and continuous refresh 8. LVTTL interface 9. 54-ball 7.0x7.5mm BGA package -
Pinout
The H5DU2562GTR-E3C is a DDR2 SDRAM with a pin count of 60. It is a 512MB memory chip with a speed of 333MHz (PC2-5300) and a data transfer rate of 667Mbps. It is commonly used in computer systems and networking devices. -
Manufacturer
Hynix is the manufacturer of the H5DU2562GTR-E3C. Hynix is a South Korean electronics company that specializes in producing memory products, including DRAM and NAND flash memory chips. They are known for their high-quality and high-performance memory solutions used in a variety of electronic devices. -
Application Field
The H5DU2562GTR-E3C is commonly used in applications such as high-performance computing, networking equipment, telecommunications systems, and industrial automation. It is ideal for use in devices that require high-speed, high-density memory for data processing and storage, due to its 256Mb capacity and fast data transfer rates. -
Package
The H5DU2562GTR-E3C chip comes in a 54-ball FBGA (Fine-pitch Ball Grid Array) package. It is in the form of an integrated circuit (IC) with a size of 8mm x 12mm.
We provide high quality products, thoughtful service and after sale guarantee
-
![Product]( "Product")
We have rich products, can meet your various needs.
-
![quantity]( "quantity")
Minimum order quantity starts from 1pcs.
-
![shipping]( "shipping")
Lowest international shipping fee starts from $0.00
-
![guarantee]( "guarantee")
365 days quality guarantee for all products
