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H5TQ4G63EFR-RDC 48HRS

DDR DRAM,

ISO14001 ISO9001 DUNS

Brands: SK HYNIX INC

Mfr.Part #: H5TQ4G63EFR-RDC

Datasheet: H5TQ4G63EFR-RDC Datasheet (PDF)

Package/Case: TFBGA

RoHS Status:

Stock Condition: 6554 pcs, New Original

Product Type: DRAMs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $2.853 $2.853
10 $2.503 $25.030
30 $2.283 $68.490
160 $1.892 $302.720
480 $1.792 $860.160
960 $1.747 $1677.120

In Stock:6554 PCS

- +

Quick Quote

Please submit RFQ for H5TQ4G63EFR-RDC or email to us: Email: [email protected], we will contact you within 12 hours.

H5TQ4G63EFR-RDC General Description

The H5TQ2G43CFR-xxC, H5TQ2G83CFR-xxC are a 2,147,483,648-bit CMOS Double Data Rate III (DDR3) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density and high bandwidth. SK hynix 2Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.

H5TQ4G63EFR-RDC

Features

VDD=VDDQ=1.5V +/- 0.075V Fully differential clock inputs (CK, CK) operation Differential Data Strobe (DQS, DQS) On chip DLL align DQ, DQS and DQS transition with CKtransition DM masks write data-in at the both rising and fallingedges of the data strobe All addresses and control inputs except data,data strobes and data masks latched on therising edges of the clock Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13 and 14 supported Programmable additive latency 0, CL-1, and CL-2supported Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10 Programmable burst length 4/8 with both nibblesequential and interleave mode BL switch on the fly 8banks Average Refresh Cycle (Tcase of0 oC~ 95oC)- 7.8 s at 0oC ~ 85 oC- 3.9 s at 85oC ~ 95 oC JEDEC standard 78ball FBGA(x4/x8) Driver strength selected by EMRS Dynamic On Die Termination supported Asynchronous RESET pin supported ZQ calibration supported TDQS (Termination Data Strobe) supported (x8 only) Write Levelization supported 8 bit pre-fetch This product in compliance with the RoHS directive.

Application

  • Computing applications (such as desktop and laptop computers, servers, etc.)
  • Networking equipment
  • Embedded systems
  • Consumer electronics (such as gaming consoles)

Specifications

Parameter Value Parameter Value
Product Name H5TQ4G63EFR-RDC Product Type DDR3 SDRAM
Manufacturer Hynix Memory Technology Synchronous DRAM (SDRAM)
Configuration 4Gb x 8 Interface Parallel
Voltage - Supply 1.35V ~ 1.5V Operating Temperature 0°C ~ 95°C
Mounting Type Surface Mount

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The H5TQ4G63EFR-RDC chip is a type of DDR3 SDRAM memory chip, commonly used in electronic devices such as smartphones, tablets, and computer systems. It has a storage capacity of 4 gigabits (512 megabytes) and operates at a high speed, making it suitable for multitasking and data-intensive applications. It provides fast and efficient data storage and retrieval for improved device performance.
  • Features

    H5TQ4G63EFR-RDC is a 4Gb LPDDR4X SDRAM with a 3200Mbps data rate. It offers low power consumption, high bandwidth, and high density while maintaining fast performance. The memory module supports various applications in mobile devices, providing efficient multitasking and faster data processing capabilities.
  • Pinout

    The H5TQ4G63EFR-RDC is a DDR3 SDRAM chip. It has a pin count of 96 and is commonly used in electronic devices such as smartphones and tablets for storage and processing of data. Its function is to provide high-speed data transfer between the device and the memory, enabling efficient performance.
  • Manufacturer

    The manufacturer of the H5TQ4G63EFR-RDC is SK Hynix. SK Hynix is a South Korean company specializing in the production of semiconductors, memory solutions, and integrated circuits.
  • Application Field

    The H5TQ4G63EFR-RDC is a DDR3 SDRAM memory chip commonly used in electronic devices such as smartphones, tablets, and computers. It provides high-speed data transfer and storage capabilities, making it suitable for applications that require quick and reliable memory access, such as gaming, multimedia processing, and multitasking.
  • Package

    The H5TQ4G63EFR-RDC chip comes in a FBGA package type, has a width of 8mm x 10mm, and a thickness of 1.2mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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