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H5TQ1G83BFR-H9C
DDR DRAM, 128MX18, 20ns, CMOS, PBGA78, HALOGEN FREE & ROHS COMPLIANT, FPBGA-78
Brands: SK HYNIX INC
Mfr.Part #: H5TQ1G83BFR-H9C
Datasheet: H5TQ1G83BFR-H9C Datasheet (PDF)
Package/Case: FBGA-78
Product Type: DRAMs
RoHS Status:
Stock Condition: 6554 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Features
- VDD=VDDQ=1.5V +/- 0.075V
- Fully differential clock inputs (CK, CK) operation
- Differential Data Strobe (DQS, DQS)
- On chip DLL align DQ, DQS and DQS transition with CK
- transition
- DM masks write data-in at the both rising and falling
- edges of the data strobe
- All addresses and control inputs except data,
- data strobes and data masks latched on the
- rising edges of the clock
- Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13
- and 14 supported
- Programmable additive latency 0, CL-1, and CL-2
- supported
- Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10
- Programmable burst length 4/8 with both nibble
- sequential and interleave mode
- BL switch on the fly
- 8banks
- Average Refresh Cycle (Tcase of0 oC~ 95oC)
- - 7.8 µs at 0oC ~ 85 oC
- - 3.9 µs at 85oC ~ 95 oC
- JEDEC standard 78ball FBGA(x4/x8)
- Driver strength selected by EMRS
- Dynamic On Die Termination supported
- Asynchronous RESET pin supported
- ZQ calibration supported
- TDQS (Termination Data Strobe) supported (x8 only)
- Write Levelization supported
- 8 bit pre-fetch
- This product in compliance with the RoHS directive.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Rohs Code | Yes | Part Life Cycle Code | Obsolete |
| Ihs Manufacturer | SK HYNIX INC | Part Package Code | BGA |
| Package Description | TFBGA, BGA78,9X13,32 | Pin Count | 78 |
| Reach Compliance Code | ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | Access Mode | MULTI BANK PAGE BURST |
| Access Time-Max | 20 ns | Additional Feature | AUTO/SELF REFRESH |
| Clock Frequency-Max (fCLK) | 667 MHz | I/O Type | COMMON |
| Interleaved Burst Length | 4,8 | JESD-30 Code | R-PBGA-B78 |
| JESD-609 Code | e1 | Length | 11 mm |
| Memory Density | 2415919104 bit | Memory IC Type | DDR3 DRAM |
| Memory Width | 18 | Number of Functions | 1 |
| Number of Ports | 1 | Number of Terminals | 78 |
| Number of Words | 134217728 words | Number of Words Code | 128000000 |
| Operating Mode | SYNCHRONOUS | Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | Organization | 128MX18 | |
| Output Characteristics | 3-STATE | Package Body Material | PLASTIC/EPOXY |
| Package Code | TFBGA | Package Equivalence Code | BGA78,9X13,32 |
| Package Shape | RECTANGULAR | Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 | Qualification Status | Not Qualified |
| Refresh Cycles | 8192 | Seated Height-Max | 1.2 mm |
| Self Refresh | YES | Sequential Burst Length | 4,8 |
| Supply Current-Max | 0.2 mA | Supply Voltage-Max (Vsup) | 1.575 V |
| Supply Voltage-Min (Vsup) | 1.425 V | Supply Voltage-Nom (Vsup) | 1.5 V |
| Surface Mount | YES | Technology | CMOS |
| Temperature Grade | OTHER | Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Terminal Form | BALL | Terminal Pitch | 0.8 mm |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 20 |
| Width | 7.5 mm |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The H5TQ1G83BFR-H9C is a chip commonly used in smartphones and other electronic devices. It is a high-performance, low-power DDR3L SDRAM chip manufactured by SK Hynix. With a capacity of 1 gigabit and a frequency of 933 MHz, it provides fast and efficient memory access for improved device performance.
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Features
H5TQ1G83BFR-H9C is a DDR4 SDRAM chip manufactured by SK Hynix. It has a capacity of 1 gigabit, operates at a speed of 2400 MHz, and is designed to be used in high-performance computing systems. It features low power consumption and high data transfer rates, making it suitable for various applications. -
Pinout
The H5TQ1G83BFR-H9C is a DDR3 SDRAM chip with a pin count of 60. Its main function is to provide storage capacity and fast data transfer rates for computing devices, such as smartphones, tablets, and other electronic devices. -
Manufacturer
H5TQ1G83BFR-H9C is manufactured by SK Hynix, a South Korean semiconductor company. It is one of the world's largest manufacturers of memory chips, including DRAM and NAND flash, and a leading provider of various semiconductor solutions for mobile devices, computers, servers, and more. -
Application Field
The H5TQ1G83BFR-H9C is a high-performance DDR2 SDRAM memory component. It can be used in various electronic devices such as smartphones, tablets, portable gaming consoles, and networking equipment to enhance their memory and processing capabilities. -
Package
The H5TQ1G83BFR-H9C chip has a package type of BGA (Ball Grid Array), a form factor of FBGA (Fine Ball Grid Array), and a size of 11.5mm x 13mm.
We provide high quality products, thoughtful service and after sale guarantee
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Minimum order quantity starts from 1pcs.
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