H5TQ1G63BFR-12C
DDR DRAM, 64MX16, 0.255ns, CMOS, PBGA96, HALOGEN FREE, FBGA-96
Brands: SKHYNIX
Mfr.Part #: H5TQ1G63BFR-12C
Datasheet: H5TQ1G63BFR-12C Datasheet (PDF)
Package/Case: BGA-96
Product Type: Memory
RoHS Status:
Stock Condition: 7797 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomH5TQ1G63BFR-12C General Description
DescriptionThe H5TQ2G43CFR-xxC, H5TQ2G83CFR-xxC are a 2,147,483,648-bit CMOS Double Data Rate III (DDR3) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density and high bandwidth. SK hynix 2Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.FEATURES• VDD=VDDQ=1.5V +/- 0.075V• Fully differential clock inputs (CK, CK) operation• Differential Data Strobe (DQS, DQS)• On chip DLL align DQ, DQS and DQS transition with CK transition• DM masks write data-in at the both rising and falling edges of the data strobe• All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock• Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13 and 14 supported• Programmable additive latency 0, CL-1, and CL-2 supported• Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10• Programmable burst length 4/8 with both nibble sequential and interleave mode• BL switch on the fly• 8banks• Average Refresh Cycle (Tcase of0 oC~ 95oC) - 7.8 µs at 0oC ~ 85 oC - 3.9 µs at 85oC ~ 95 oC• JEDEC standard 78ball FBGA(x4/x8)• Driver strength selected by EMRS• Dynamic On Die Termination supported• Asynchronous RESET pin supported• ZQ calibration supported• TDQS (Termination Data Strobe) supported (x8 only)• Write Levelization supported• 8 bit pre-fetch• This product in compliance with the RoHS directive.
Features
- VDD=VDDQ=1.5V +/- 0.075V
- Fully differential clock inputs (CK, CK) operation
- Differential Data Strobe (DQS, DQS)
- On chip DLL align DQ, DQS and DQS transition with CK
- transition
- DM masks write data-in at the both rising and falling
- edges of the data strobe
- All addresses and control inputs except data,
- data strobes and data masks latched on the
- rising edges of the clock
- Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13
- and 14 supported
- Programmable additive latency 0, CL-1, and CL-2
- supported
- Programmable CAS Write latency (CWL) = 5, 6, 7, 8, 9, 10
- Programmable burst length 4/8 with both nibble
- sequential and interleave mode
- BL switch on the fly
- 8banks
- Average Refresh Cycle (Tcase of0 oC~ 95oC)
- - 7.8 µs at 0oC ~ 85 oC
- - 3.9 µs at 85oC ~ 95 oC
- JEDEC standard 78ball FBGA(x4/x8)
- Driver strength selected by EMRS
- Dynamic On Die Termination supported
- Asynchronous RESET pin supported
- ZQ calibration supported
- TDQS (Termination Data Strobe) supported (x8 only)
- Write Levelization supported
- 8 bit pre-fetch
- This product in compliance with the RoHS directive.
Application
- Main memory for mobile devices, such as smartphones and tablets
- Graphics processing units (GPUs) in gaming consoles and high-performance computing systems
- Digital cameras and camcorders for storing images and videos
- Network routers and switches for packet buffering and forwarding
- Embedded systems and Internet of Things (IoT) devices requiring fast and reliable memory access
- Industrial applications for data logging and processing
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Product Name | H5TQ1G63BFR-12C | Product Type | Memory |
Manufacturer | Hynix | Memory Type | DDR3 SDRAM |
Capacity | 1GB | Interface | Parallel |
Clock Frequency | 533MHz | Operating Voltage | 1.5V |
Temperature Range | -40°C ~ 85°C | Mounting Type | Surface Mount |
Package / Case | FBGA-84 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The H5TQ1G63BFR-12C chip is a type of synchronous dynamic random-access memory (SDRAM) used in electronic devices such as smartphones and tablets. It offers a capacity of 1 Gbit and operates at a clock speed of 667 MHz. The chip incorporates multiple memory banks and supports a burst mode for improved data transfer rates. It is commonly used as a main memory in consumer electronics due to its high performance and reliability.
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Equivalent
The equivalent products of the H5TQ1G63BFR-12C chip are the H5TQ1G63BFR-12C and other related DDR3 SDRAM chips. -
Features
H5TQ1G63BFR-12C is a type of dynamic random-access memory (DRAM) chip with a capacity of 1 gigabit. It operates at a frequency of 800 MHz and has a data transfer rate of 1.6 gigabytes per second. It is designed for use in various electronic devices such as smartphones, tablets, and other mobile devices. -
Pinout
The H5TQ1G63BFR-12C is a memory chip with a pin count of 78. It is a 1Gb LPDDR2 SDRAM chip used in mobile devices and offers high-speed data transfer rates. -
Manufacturer
The manufacturer of the H5TQ1G63BFR-12C is SK Hynix. SK Hynix is a South Korean semiconductor manufacturing company that specializes in the production of memory chips, including DRAM (Dynamic Random Access Memory) and NAND flash. They are known for their high-quality memory solutions, used in various electronic devices such as smartphones, computers, and servers. -
Application Field
The H5TQ1G63BFR-12C is a type of synchronous dynamic random-access memory (SDRAM) chip commonly used in mobile devices such as smartphones and tablets. It provides high-speed data storage and retrieval for applications such as gaming, multimedia playback, and multitasking. -
Package
The H5TQ1G63BFR-12C chip comes in a BGA package type with a form factor of FBGA and a size of 9mm x 11mm.
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