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Altera EP3C25F324C6N

FPGA Cyclone® III Family 24624 Cells 500MHz 65nm Technology 1.2V 324-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP3C25F324C6N

Datasheet: EP3C25F324C6N Datasheet (PDF)

Package/Case: FBGA-324

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2323 pcs, New Original

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EP3C25F324C6N General Description

Cyclone® III Field Programmable Gate Array (FPGA) IC 215 608256 24624 324-BGA

ep3c25f324c6n

Features

  • 24,624 logic elements (LEs)
  • 562 kilobits (Kbits) of embedded memory
  • 192 variable-precision digital signal processing (DSP) blocks
  • 4-phase-locked loops (PLLs)
  • 314 user I/O pins

Application

  • Video and image processing
  • Wireless and wireline communication systems
  • Industrial automation and control systems
  • High-performance computing
  • Military and aerospace systems
Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® III feature-process-technology 65nm
feature-maximum-number-of-user-i-os 215 feature-number-of-registers
feature-device-logic-cells 24624 feature-device-system-gates
feature-number-of-multipliers 66 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 594 feature-total-number-of-block-ram 66
feature-ethernet-macs feature-supported-ip-core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz
feature-supported-ip-core-manufacture Altera/Freescale/CAST, Inc/MorethanIP/PLDA feature-maximum-number-of-serdes-channels
feature-device-logic-units 24624 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks
feature-programmability No feature-maximum-internal-frequency-mhz 500
feature-speed-grade 6 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 324 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc Yes

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the EP3C25F324C6N component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   EP3C25F324I7N

Brands :  

Package :   FBGA-324

Description :   FPGA Cyclone® III Family 24624 Cells 437.5MHz 65nm Technology 1.2V

Part Number :   EP3C25U256I7N

Brands :  

Package :   BGA-256

Description :   FPGA Cyclone III Family 24624 Cells 437.5MHz 65nm Technology 1.2V 256Pin UFBGA

Part Number :   EP3C25F324C7N

Brands :  

Package :   FBGA-324

Description :   Cyclone™ III FPGAs: An Unprecedented Combination of Power, Functionality, and Cost; 324 pin FBGA; 0 to 85°C

Part Number :   EP3C25F324I8N

Brands :  

Package :  

Description :  

Part Number :   EP3C25U256C8N

Brands :  

Package :   BGA-256

Description :   FPGA, CYCLONE III, 25K LE, 256UBGA Programmable Logic Type:FPGA; Logic IC function:FPGA; Logic IC family:Cyclone III; Logic IC Base Number:3; I/O lines, No. of:156;

Part Number :   EP3C25U256C7N

Brands :  

Package :   BGA-256

Description :   Cyclone™ III FPGAs: An Unprecedented Combination of Power, Functionality, and Cost; 256 pin UBGA; 0 to 85°C

Part Number :   EP3C25F256C6N

Brands :  

Package :   FBGA-256

Description :   Cyclone™ III FPGAs: An Unprecedented Combination of Power, Functionality, and Cost; 256 pin FBGA; 0 to 85°C

Part Number :   EP3C25F324A7N

Brands :  

Package :   FBGA-324

Description :   FPGA - Field Programmable Gate Array FPGA - Cyclone III 1539 LABs 215 IOs

Part points

  • The EP3C25F324C6N chip is a Field-Programmable Gate Array (FPGA) produced by Altera. It belongs to the Cyclone III family and offers 24,624 logic elements. The chip is designed for various applications, including telecommunications, digital signal processing, and industrial automation. It provides flexibility and reprogrammability, allowing users to create custom digital circuits to meet specific requirements.
  • Equivalent

    EP3C25F324C6N is a member of the Cyclone III FPGA family. Equivalent products in the same family would be chips like EP3C25F256C6N, EP3C25E144C6N, and EP3C25Q240C6N. These chips have similar features and capabilities, but may have differences in terms of package size, pin count, or other specifications.
  • Features

    The EP3C25F324C6N is a high-performance field-programmable gate array (FPGA) from the Cyclone III series. It has 24,624 logic elements, 588 kilobytes of embedded memory, and supports up to 346 user I/Os. This FPGA offers low-power consumption and provides various configurable options for implementing complex digital designs.
  • Pinout

    The EP3C25F324C6N is a FPGA (Field Programmable Gate Array) device with a pin count of 324. It has various functions such as configurable logic blocks, embedded memory, digital signal processing, and I/O interfaces.
  • Manufacturer

    The EP3C25F324C6N is manufactured by Altera Corporation. It is a semiconductor company specializing in programmable logic devices and related software development tools.
  • Application Field

    The EP3C25F324C6N is an FPGA (Field-Programmable Gate Array) that can be used in various applications such as telecommunications, industrial automation, video and image processing, automotive systems, and more. Its high speed and flexibility make it suitable for tasks requiring complex logic functions and real-time data processing.
  • Package

    The EP3C25F324C6N chip is packaged in a plastic BGA (Ball Grid Array) package. It has a 324-pin design and measures approximately 15 mm by 15 mm in size.

Datasheet PDF

Preliminary Specification EP3C25F324C6N PDF Download

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