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Altera EP4CGX75CF23C8N

FPGA Cyclone® IV GX Family 73920 Cells 60nm Technology 1.2V 484-Pin FBGA

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP4CGX75CF23C8N

Datasheet: EP4CGX75CF23C8N Datasheet (PDF)

Package/Case: FBGA-484

RoHS Status:

Stock Condition: 3616 pcs, New Original

Product Type: Programmable Logic ICs

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $566.126 $566.126
180 $225.888 $40659.840
480 $218.340 $104803.200
1020 $214.611 $218903.220

In Stock:3616 PCS

- +

Quick Quote

Please submit RFQ for EP4CGX75CF23C8N or email to us: Email: [email protected], we will contact you within 12 hours.

EP4CGX75CF23C8N General Description

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 4257792 73920 484-BGA

Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV GX feature-process-technology 60nm
feature-maximum-number-of-user-i-os 290 feature-number-of-registers
feature-device-logic-cells 73920 feature-device-system-gates
feature-number-of-multipliers 198 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 4158 feature-total-number-of-block-ram 462
feature-ethernet-macs feature-supported-ip-core Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|Sub-frame Latency JPEG 2000 Encoder (BA130)|PCI Express to AXI Bridge Controller (GPEX-PAB)|ISA/PC Card/PCMCIA/Compact Flash Host Adapter
feature-supported-ip-core-manufacture Altera/CAST, Inc/Barco Silex/Mobiveil, Inc/Eureka Technology Inc feature-maximum-number-of-serdes-channels
feature-device-logic-units 73920 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks 8 feature-transceiver-speed-gbps 3.125
feature-dedicated-dsp feature-pci-blocks 1
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 8 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.16
feature-maximum-operating-supply-voltage-v 1.24 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 484 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc No

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CGX75CF23C8N chip is a field-programmable gate array (FPGA) produced by Intel (formerly Altera). It belongs to the Cyclone IV series and offers 75,000 logic elements. With a maximum operating frequency of 300 MHz and other built-in features like embedded memory and digital signal processing blocks, it is widely used for various applications like industrial automation, communications, and image processing.
  • Equivalent

    Some equivalent products of the EP4CGX75CF23C8N chip are Xilinx Spartan-4 FPGA, Lattice ECP4 FPGA, and Altera Cyclone IV FPGA.
  • Features

    The EP4CGX75CF23C8N is an FPGA (Field-Programmable Gate Array) from the Cyclone IV series by Intel. It features 74,880 Logic Elements (LEs), 414 embedded 18x18 multipliers, 1,288 embedded 9-Kbit memory blocks, and up to 622 user I/O pins. It is designed for low power consumption and offers high performance and flexibility for various applications.
  • Pinout

    The pin count of the EP4CGX75CF23C8N is 672 pins. It is a Cyclone IV GX FPGA by Intel (formerly Altera), specifically from series 4CGX. The specific functions of each pin can be found in the datasheet provided by Intel.
  • Manufacturer

    The manufacturer of the EP4CGX75CF23C8N is Intel Corporation. Intel is a multinational technology company that specializes in the design and manufacture of semiconductor chips and other related technologies. It is known for its wide range of products, including microprocessors, memory chips, and other integrated circuit components.
  • Application Field

    The EP4CGX75CF23C8N is a field-programmable gate array that is commonly used in a variety of application areas such as telecommunications, automotive, industrial automation, and consumer electronics. It is particularly suited for applications that require high-performance processing, parallel computing, and real-time data processing.
  • Package

    The EP4CGX75CF23C8N chip comes in a FBGA (Fine-pitch Ball Grid Array) package type, with a size of 23mm x 23mm.

Datasheet PDF

Preliminary Specification EP4CGX75CF23C8N PDF Download

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