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Altera EP4CE75F23C7N

FPGA Cyclone® IV E Family 75408 Cells 60nm Technology 1.2V 484-Pin FBGA

Ovaga Certification

Brands: Altera Corporation (Intel)

Mfr.Part #: EP4CE75F23C7N

Datasheet: EP4CE75F23C7N Datasheet (PDF)

Package/Case: FBGA-484

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3807 pcs, New Original

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EP4CE75F23C7N General Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 292 2810880 75408 484-BGA

ep4ce75f23c7n

Features

  • 74,880 logic elements (LEs)
  • 4.8 Mbits of RAM
  • 266 embedded multipliers
  • 4 phase-locked loops (PLLs)
  • 322 user I/O pins
  • Support for a range of I/O standards, including LVDS, SSTL, and HSTL

Application

  • Digital signal processing (DSP)
  • High-speed serial communication
  • Video processing and display
  • Industrial automation and control
  • Test and measurement equipment
  • Military and aerospace systems
Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV E feature-process-technology 60nm
feature-maximum-number-of-user-i-os 292 feature-number-of-registers
feature-device-logic-cells 75408 feature-device-system-gates
feature-number-of-multipliers 200 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 2745 feature-total-number-of-block-ram 305
feature-ethernet-macs feature-supported-ip-core Sub-frame Latency JPEG 2000 Encoder (BA130)|RapidIO to AXI Bridge Controller (RAB)|EtherCAT|EtherNET/IP|DS1/E1 TDM over Packet IP core
feature-supported-ip-core-manufacture Barco Silex/Mobiveil, Inc/Beckhoff Automation GmbH/Softing AG/Aimvalley feature-maximum-number-of-serdes-channels
feature-device-logic-units 75408 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks 1
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 7 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported B-LVDS|HSTL|LVPECL|LVDS|RSDS|SSTL feature-single-ended-i-o-standards-supported LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL
feature-external-memory-interface DDR SDRAM|DDR2 SDRAM|QDRII+SRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 484 feature-supplier-package FBGA
feature-standard-package-name1 BGA feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code 3A991
feature-svhc Yes

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CE75F23C7N is a field-programmable gate array (FPGA) chip from the Cyclone IV series by Intel. It features 75,000 logic elements, 4,594 kbits of embedded memory, and 288 18x18-bit multipliers. The C7 version includes 7:1 LVDS transceivers and is suitable for a wide range of applications requiring high-performance, low-power FPGA capabilities.
  • Equivalent

    Some equivalent products of EP4CE75F23C7N chip are EP4CE75F23I7N, EP4CE75F23C7, and EP4CE75F29C7. These chips belong to the same Altera Cyclone IV series and have similar features and capabilities.
  • Features

    - 75,000 logic elements (LEs) - 244 embedded 18 x 18 multipliers - 6,921 Kbits of embedded memory - 475 user I/Os - 3.3 V or 2.5 V operation - 277 user I/Os - 748 user I/Os total - 484 user I/Os total - 1.2 V core voltage
  • Pinout

    The EP4CE75F23C7N is a Cyclone IV FPGA with 672-pin count. It is a high-performance programmable logic device with 75,000 logic elements, suitable for a wide range of applications such as industrial automation, automotive, and communication systems.
  • Manufacturer

    The EP4CE75F23C7N is manufactured by Intel Corporation, which is a multinational corporation specializing in semiconductor design and manufacturing. Intel is one of the largest and most well-known companies in the technology industry, producing a wide range of products including CPUs, FPGAs, and other semiconductor solutions.
  • Application Field

    The EP4CE75F23C7N is commonly used in applications such as industrial automation, telecommunications, automotive electronics, video and image processing, and high-performance computing. It is also suitable for use in medical devices, aerospace, defense systems, and networking equipment due to its flexibility, high-performance capabilities, and low power consumption.
  • Package

    The EP4CE75F23C7N chip comes in a 780-pin Flip-Chip BGA package. It is in a rectangular form measuring 29mm x 29mm.

Datasheet PDF

Preliminary Specification EP4CE75F23C7N PDF Download

Key points

  • The EP4CE75F23C7N is a field-programmable gate array (FPGA) chip from the Cyclone IV series by Intel. It features 75,000 logic elements, 4,594 kbits of embedded memory, and 288 18x18-bit multipliers. The C7 version includes 7:1 LVDS transceivers and is suitable for a wide range of applications requiring high-performance, low-power FPGA capabilities.
  • Equivalent

    Some equivalent products of EP4CE75F23C7N chip are EP4CE75F23I7N, EP4CE75F23C7, and EP4CE75F29C7. These chips belong to the same Altera Cyclone IV series and have similar features and capabilities.
  • Features

    - 75,000 logic elements (LEs) - 244 embedded 18 x 18 multipliers - 6,921 Kbits of embedded memory - 475 user I/Os - 3.3 V or 2.5 V operation - 277 user I/Os - 748 user I/Os total - 484 user I/Os total - 1.2 V core voltage
  • Pinout

    The EP4CE75F23C7N is a Cyclone IV FPGA with 672-pin count. It is a high-performance programmable logic device with 75,000 logic elements, suitable for a wide range of applications such as industrial automation, automotive, and communication systems.
  • Manufacturer

    The EP4CE75F23C7N is manufactured by Intel Corporation, which is a multinational corporation specializing in semiconductor design and manufacturing. Intel is one of the largest and most well-known companies in the technology industry, producing a wide range of products including CPUs, FPGAs, and other semiconductor solutions.
  • Application Field

    The EP4CE75F23C7N is commonly used in applications such as industrial automation, telecommunications, automotive electronics, video and image processing, and high-performance computing. It is also suitable for use in medical devices, aerospace, defense systems, and networking equipment due to its flexibility, high-performance capabilities, and low power consumption.
  • Package

    The EP4CE75F23C7N chip comes in a 780-pin Flip-Chip BGA package. It is in a rectangular form measuring 29mm x 29mm.

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  • quantity

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    365 days quality guarantee for all products

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