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Altera EP4CGX110DF31I7N
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 475 5621760 109424 896-BGA
Brands: Altera Corporation (Intel)
Mfr.Part #: EP4CGX110DF31I7N
Datasheet: EP4CGX110DF31I7N Datasheet (PDF)
Package/Case: FBGA-896
Product Type: Programmable Logic ICs
EP4CGX110DF31I7N General Description
Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 475 5621760 109424 896-BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 896 | Package Category | BGA |
| Released Date | Jan 26, 2021 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The EP4CGX110DF31I7N is a Field-Programmable Gate Array (FPGA) chip from Intel (formerly Altera) designed for high-performance applications. It features 110,000 logic elements, embedded memory blocks, and high-speed transceivers for efficient processing and communication. This chip is commonly used in telecommunications, networking, and industrial automation industries.
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Equivalent
Some equivalent products of the EP4CGX110DF31I7N chip are EP4CGX110DF31C7, EP4CGX110DF27I7N, EP4CGX110DF27C7N, and EP4CGX110DF27C6N. These chips belong to the same family of Altera Cyclone IV GX FPGAs and provide similar features and capabilities. -
Features
EP4CGX110DF31I7N is a low-cost FPGA with 110K logic elements, 4740 Kbits embedded RAM, and 338 user I/Os. It features up to 464 embedded multipliers and on-chip PLLs for clock management. It also has low power consumption, making it suitable for a wide range of applications. -
Pinout
The EP4CGX110DF31I7N is a 324-pin FPGA (Field-Programmable Gate Array) with 110,592 logic elements, 5,760 Kbits of embedded memory, and 266 I/O pins. Its functions include processing and storing data, implementing custom logic functions, and interfacing with external devices through the I/O pins. -
Manufacturer
The EP4CGX110DF31I7N is manufactured by Intel Corporation. Intel is a multinational technology company specializing in the design and manufacture of various computer hardware, software, and semiconductor products. They are one of the largest and most well-known companies in the tech industry, known for their processors, memory chips, and other electronic components. -
Application Field
The EP4CGX110DF31I7N is commonly used in applications such as industrial automation, communication infrastructure, automotive, and consumer electronics. It is especially well-suited for high-performance computing, signal processing, and data communication tasks due to its high logic density and advanced features. -
Package
The EP4CGX110DF31I7N chip comes in a Ball Grid Array (BGA) package with a form factor of 31x31 mm and a size of 31x31 mm.
Datasheet PDF
Key points
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The EP4CGX110DF31I7N is a Field-Programmable Gate Array (FPGA) chip from Intel (formerly Altera) designed for high-performance applications. It features 110,000 logic elements, embedded memory blocks, and high-speed transceivers for efficient processing and communication. This chip is commonly used in telecommunications, networking, and industrial automation industries.
-
Equivalent
Some equivalent products of the EP4CGX110DF31I7N chip are EP4CGX110DF31C7, EP4CGX110DF27I7N, EP4CGX110DF27C7N, and EP4CGX110DF27C6N. These chips belong to the same family of Altera Cyclone IV GX FPGAs and provide similar features and capabilities. -
Features
EP4CGX110DF31I7N is a low-cost FPGA with 110K logic elements, 4740 Kbits embedded RAM, and 338 user I/Os. It features up to 464 embedded multipliers and on-chip PLLs for clock management. It also has low power consumption, making it suitable for a wide range of applications. -
Pinout
The EP4CGX110DF31I7N is a 324-pin FPGA (Field-Programmable Gate Array) with 110,592 logic elements, 5,760 Kbits of embedded memory, and 266 I/O pins. Its functions include processing and storing data, implementing custom logic functions, and interfacing with external devices through the I/O pins. -
Manufacturer
The EP4CGX110DF31I7N is manufactured by Intel Corporation. Intel is a multinational technology company specializing in the design and manufacture of various computer hardware, software, and semiconductor products. They are one of the largest and most well-known companies in the tech industry, known for their processors, memory chips, and other electronic components. -
Application Field
The EP4CGX110DF31I7N is commonly used in applications such as industrial automation, communication infrastructure, automotive, and consumer electronics. It is especially well-suited for high-performance computing, signal processing, and data communication tasks due to its high logic density and advanced features. -
Package
The EP4CGX110DF31I7N chip comes in a Ball Grid Array (BGA) package with a form factor of 31x31 mm and a size of 31x31 mm.
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