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Intel 5CEFA9F23I7N

Cyclone® V E Field Programmable Gate Array (FPGA) IC 224 14251008 301000 484-BGA

ISO14001 ISO9001 DUNS

Brands: Intel Corp

Mfr.Part #: 5CEFA9F23I7N

Datasheet: 5CEFA9F23I7N Datasheet (PDF)

Package/Case: FBGA-484

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2660 pcs, New Original

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5cefa9f23i7n

Features

Pin Count: 484
Maximum Operating Temperature (°C): 100
Program Memory Type: SRAM
Operating Supply Voltage (V): 1.1
I/O Voltage (V): Various voltage levels, including 3V, 2.5V, 1.8V, 3.3V, 1.2V, 1.25V, 1.35V, and 1.5V
Supplier Temperature Grade: Industrial
Total Number of Block RAM: 1,220
Speed Grade: 7
Embedded Memory (Kbit): 12,200
Number of Multipliers: 684 (18x18)
Process Technology: 28nm
Logic Elements: 301,000
Mounting: Surface Mount
External Memory Interface: Supports DDR3 SDRAM, LPDDR2, and DDR2 SDRAM
JTAG Support: Yes
Reprogrammability Support: Yes
Minimum Operating Temperature (°C): -40
Maximum I/O Performance: 5 Gbps

Application

This device is designed for a wide range of applications that require programmable logic and DSP capabilities. FPGAs like this can be used in various fields, including telecommunications, industrial automation, and embedded systems.

Specifications

Parameter Value Parameter Value
Pin Count 484 Package Category BGA
Released Date Jan 14, 2019

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The 5CEFA9F23I7N chip is a highly advanced semiconductor chip designed for various applications. it offers superior performance, efficiency and versatility due to its advanced architecture and integrated features. the chip enables reliable and powerful processing capabilities, making it ideal for use in a wide range of industries, including automotive, telecommunications, and consumer electronics.
  • Equivalent

    Xilinx does not provide an exact equivalent product for the 5CEFA9F23I7N fpga chip. however, similar devices from the xilinx 7 series fpgas may be used as alternatives, such as the xc7a50t or xc7s50. these devices offer similar capabilities and performance to the 5CEFA9F23I7N chip.
  • Features

    The features of 5CEFA9F23I7N are: - high-performance 5th generation cyclone fpga - low power consumption - integrated high-speed transceivers - flexible logic fabric - large embedded ram capacity - advanced dsp capabilities - enhanced security features - wide range of i/o interfaces - user-friendly programming and design tools.
  • Pinout

    The 5CEFA9F23I7N is an fpga (field-programmable gate array) with a bga (ball grid array) package. it has a pin count of 672, and its specific pin functions can vary depending on the configuration and design implemented by the user.
  • Manufacturer

    The manufacturer of the 5CEFA9F23I7N is intel. it is an american multinational technology company specializing in semiconductor chip manufacturing.

Datasheet PDF

Preliminary Specification 5CEFA9F23I7N PDF Download

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  • quantity

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