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Xilinx XCV150-5BG256I
Field Programmable Gate Array FPGA XCV150-5BG256I
Brands: Xilinx
Mfr.Part #: XCV150-5BG256I
Datasheet: XCV150-5BG256I Datasheet (PDF)
Package/Case: BGA-256
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3019 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXCV150-5BG256I General Description
The XCV150-5BG256I is a Field Programmable Gate Array (FPGA) from Xilinx, a leading provider of programmable logic devices. It belongs to the XC9500 family of FPGAs and is designed for high-performance applications.Key details of the XCV150-5BG256I include:- 150,000 system gates- 19,200 logic cells- 4736 macrocells- 400 MHz internal operating frequency- 256-pin ball grid array (BGA) package- 3.3V core voltage- 5 ns pin-to-pin logic delays- 400 MHz internal configuration rate- Built-in boundary scan test logic- IEEE 1149.1 (JTAG) support for on-chip debugThe XCV150-5BG256I offers a good balance between logic capacity, performance, and cost, making it suitable for a wide range of applications such as telecommunications, networking, industrial control, and automotive.
Features
- 256-ball ball-grid array (BGA) package
- 150,000 system gates
- 5ns pin-to-pin logic delays
- High-performance 0.25 micron process technology
- 3.3V supply voltage
- Multiple I/O standards
Application
- Telecommunication systems
- Network routers and switches
- Industrial automation
- Medical equipment
- Automotive systems
- Consumer electronics
- Military and aerospace applications
- Data storage systems
- Embedded systems
- Instrumentation and measurement systems
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | Series | XCV150 |
| Number of Logic Elements | 3888 LE | Adaptive Logic Modules - ALMs | 1728 ALM |
| Embedded Memory | 48 kbit | Number of I/Os | 180 I/O |
| Supply Voltage - Min | 2.5 V | Supply Voltage - Max | 2.5 V |
| Minimum Operating Temperature | - 40 C | Maximum Operating Temperature | + 100 C |
| Mounting Style | SMD/SMT | Package / Case | BGA-256 |
| Brand | Xilinx | Embedded Block RAM - EBR | 49152 bit |
| Maximum Operating Frequency | 200 MHz | Number of Gates | 164674 |
| Number of Logic Array Blocks - LABs | 864 LAB | Operating Supply Voltage | 2.5 V |
| Product Type | FPGA - Field Programmable Gate Array | Subcategory | Programmable Logic ICs |
| Tradename | Virtex |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XCV150-5BG256I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC2V1500-4FGG676C
Brands :
Package : 676-BGA
Description : 1500000 SYSTEM GATE 1.5 VOLT FPGA
Part Number : XC2V1500-5FF896I
Brands :
Package : FCBGA89
Description : Virtex-II 1.5V Field-Programmable Gate Arrays
Part Number : XC2V1500-5FG676C
Brands :
Package : FBGA-676
Description : FPGA Virtex-II Family 1.5M Gates 17280 Cells 750MHz 0.15um Technology 1.5V 676-Pin FBGA
Part Number : XC2V1500-6FG676C
Brands :
Package : BGA-676
Description : Virtex-II 1.5V Field-Programmable Gate Arrays
Part points
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The XCV150-5BG256I chip is a programmable logic device manufactured by Xilinx. It belongs to the Virtex II series and is available in a 256-pin BGA package. It offers 150,000 system gates with up to 5ns pin-to-pin delay. This chip is used in applications requiring high-density, high-speed, and complex programmable logic functions.
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Equivalent
The equivalent product of the XCV150-5BG256I chip is the Spartan-II XC2S150-5FG256I chip. -
Features
The XCV150-5BG256I is a model of Field Programmable Gate Array (FPGA) integrated circuit. Its features include a high-density, high-performance programmable logic solution, with a capacity of 153,024 system gates, 5ns pin-to-pin logic delays, and 750MHz system performance. It also offers abundant general-purpose I/O pins, versatile configuration options, and a low-power consumption design. -
Pinout
The XCV150-5BG256I is a field-programmable gate array (FPGA) with a 256-pin Ball Grid Array (BGA) package. It offers 150,000 system gates and operates at a 5V voltage level. This FPGA is designed for various applications and can be programmed to perform different functions based on the user's requirements. -
Manufacturer
The manufacturer of the XCV150-5BG256I is Xilinx. Xilinx is a semiconductor company that specializes in programmable logic devices and related programming tools. -
Application Field
The XCV150-5BG256I, a programmable logic device (PLD), is commonly used in various application areas, including telecommunications, data processing, networking, and industrial control systems. It provides high-performance and flexible logic functions, making it suitable for a range of applications that require reliable and customizable digital circuitry. -
Package
The XCV150-5BG256I chip is available in a Ball Grid Array (BGA) package type. Its form is integrated circuit (IC) and its size is 256 ball grid array (BGA).
Datasheet PDF
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