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Xilinx XC7Z030-1FBG676I
SoC FPGA XC7Z030-1FBG676I
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7Z030-1FBG676I
Datasheet: XC7Z030-1FBG676I Datasheet (PDF)
Package/Case: FBGA676
Product Type: System On Chip (SoC)
RoHS Status:
Stock Condition: 3091 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7Z030-1FBG676I General Description
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-676; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:676Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z030-1FBG676I
Features
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells256KB 667MHz 676-FCBGA (27x27)Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells256KB 667MHz 676-FCBGA (27x27)
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FCBGA | Contact Plating | Copper, Silver, Tin |
| Number of Pins | 676 | Core Architecture | ARM |
| Data Bus Width | 32 b | Frequency | 667 MHz |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | Max Frequency | 667 MHz |
| Max Operating Temperature | 100 °C | Min Operating Temperature | -40 °C |
| Number of I/Os | 130 | Operating Supply Voltage | 1 V |
| Peripherals | DMA |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7Z030-1FBG676I is a System on Chip (SoC) from Xilinx's Zynq-7000 family. It features a dual-core ARM Cortex-A9 processor along with programmable logic, making it suitable for a wide range of applications in embedded systems, IoT, and industrial automation.
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Equivalent
Some equivalent products of the XC7Z030-1FBG676I chip are XC7Z020-1CLG484I, XC7Z030-1SBG485I, and XC7Z030-1FBG676I. These chips belong to the Zynq-7000 series and offer similar processing capabilities and features for embedded applications. -
Features
1. Dual-core ARM Cortex-A9 processor 2. Programmable logic with 28,000 logic slices 3. 240 DSP slices for signal processing 4. 1 GB DDR3 memory for fast data processing 5. High-speed connectivity with Gigabit Ethernet, PCI Express, and USB interfaces 6. On-chip configuration and power management 7. Industrial-grade temperature range (-40°C to 100°C) -
Pinout
The XC7Z030-1FBG676I is a 676-pin device from Xilinx. It is a Zynq-7000 series System-on-Chip (SoC) with dual-core ARM Cortex-A9 processors and programmable logic. The pins provide various functions such as GPIO, memory interfaces, communication interfaces, and power supplies. -
Manufacturer
The manufacturer of XC7Z030-1FBG676I is Xilinx. Xilinx is an American technology company specializing in field-programmable gate array (FPGA) and programmable logic devices. They provide hardware programmable devices to enable fast and efficient computing in various industries including aerospace, automotive, and telecommunications. -
Application Field
The XC7Z030-1FBG676I is commonly used in applications such as industrial automation, automotive, aerospace, and defense. It is also deployed in communications, networking, and data center infrastructure for its high-performance processing capabilities and flexibility in designing custom accelerators. -
Package
The XC7Z030-1FBG676I chip is in a Ball Grid Array (BGA) package, with 676 pins. It has a form factor of 17mm x 17mm and a size of 676 pins.
Datasheet PDF
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