Xilinx XC7VX485T-2FFG1761I

Part points

• The XC7VX485T-2FFG1761I chip is a high-end, field-programmable gate array (FPGA) device designed by Xilinx. It offers advanced features such as high-speed interfaces, dense logic capacity, and high-performance processing capabilities. It is commonly used in applications such as aerospace, telecommunications, and data centers, where demanding performance requirements and flexibility are crucial.

• Equivalent

  The equivalent product of the XC7VX485T-2FFG1761I chip is the Xilinx Virtex-7 XC7VX485T-2FFG1761C. These chips have similar specifications and features, including the same speed grade, package type, and logic cells.

• Features

  The XC7VX485T-2FFG1761I is a Field-Programmable Gate Array (FPGA) from Xilinx. It has 485,000 logic cells, 49,920Kb Block RAM, and 1344 DSP48E1 slices. It operates at a maximum frequency of 850 MHz, has a 16.3 Mb internal memory, and supports various standards such as PCIe Gen3, Ethernet, and USB.

• Pinout

  The XCVX485T-2FFG1761I FPGA has 1761 pins. It is a high-performance device featuring high logic capacity and built-in features such as high-speed serial transceivers, DSP blocks, and memory resources, suitable for various applications, including communications, medical, industrial, and aerospace.

• Manufacturer

  The manufacturer of the XC7VX485T-2FFG1761I is Xilinx, Inc. Xilinx is a leading American technology company that specializes in the development and manufacturing of field-programmable gate arrays (FPGAs) and associated software tools. Their FPGAs are widely used in various industries such as aerospace, automotive, telecommunications, and data centers for their programmability, flexibility, and high-performance capabilities.

• Application Field

  The XC7VX485T-2FFG1761I FPGA (Field-Programmable Gate Array) can be used in various application areas such as data center acceleration, video processing, automotive, telecommunications, aerospace, and defense. It provides high performance and flexibility for implementing complex algorithms and processing tasks in these domains.

• Package

  The XC7VX485T-2FFG1761I chip is in the Flip-Chip 1761-pin Fine-Pitch Ball Utilization (FFG1761) package. Its form is a flip-chip, and it has a size of 17x17 mm.