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Xilinx XC7K70T-1FBG676I
Kintex®-7 Field Programmable Gate Array (FPGA) IC 300 4976640 65600 676-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K70T-1FBG676I
Datasheet: XC7K70T-1FBG676I Datasheet (PDF)
Package/Case: FCBGA-676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2180 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K70T-1FBG676I General Description
Kintex®-7 Field Programmable Gate Array (FPGA) IC 300 4976640 65600 676-BBGA, FCBGA
Features
IC FPGA 300 I/O 676FCBGAIC FPGA 300 I/O 676FCBGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FCBGA | Contact Plating | Copper, Silver, Tin |
| Number of Pins | 676 | Max Operating Temperature | 100 °C |
| Max Supply Voltage | 1.03 V | Min Operating Temperature | -40 °C |
| Min Supply Voltage | 970 mV | Number of ADC Channels | 1 |
| Number of I/Os | 300 | Number of Logic Blocks (LABs) | 5125 |
| Number of Logic Elements/Cells | 65600 | Number of Registers | 82000 |
| Number of Transceivers | 8 | RAM Size | 607.5 kB |
| Speed Grade | -1 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7K70T-1FBG676I is a high-performance Field Programmable Gate Array (FPGA) chip from Xilinx. It features a large capacity, with 70,000 logic cells and advanced processing capabilities, making it suitable for a wide range of applications including telecommunications, industrial automation, and image processing. Its 676-pin BGA packaging provides a compact and efficient solution for complex design requirements.
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Equivalent
The equivalent products of XC7K70T-1FBG676I chip are XC7K70T-2FBG676I, XC7K70T-3FBG676I, and XC7K70T-1CSG484I from Xilinx. These chips have similar features and performance characteristics, but may have slight differences in operating conditions or power consumption. -
Features
The XC7K70T-1FBG676I is a Xilinx Kintex-7 FPGA with 70,000 logic cells, 2.75 Mb Block RAM, 450 DSP slices, and 400 I/Os. It operates at a maximum speed of 850 MHz and has a 1.2V core voltage. Additionally, it features advanced functions such as integrated PCIe blocks, 100G Ethernet MAC, and AXI interconnect. -
Pinout
The XC7K70T-1FBG676I is a Field-Programmable Gate Array (FPGA) with 676 pins. It is part of the Xilinx Kintex-7 family and offers high performance for a range of applications. The device includes advanced features such as DSP slices, block RAM, and configurable I/O standards, making it suitable for advanced digital systems. -
Manufacturer
XC7K70T-1FBG676I is manufactured by Xilinx, Inc., a multinational technology company specializing in the design and development of programmable logic devices. Xilinx is known for its field-programmable gate arrays (FPGAs) and programmable system-on-chip (SoC) solutions, which are widely used in applications such as aerospace, defense, automotive, telecommunications, and data center industries. -
Application Field
The XC7K70T-1FBG676I is a Xilinx Kintex-7 FPGA ideal for use in high-performance applications such as aerospace, defense, communications, and industrial automation. Its large capacity, high-speed processing, and versatile programmability make it suitable for applications requiring complex algorithms, high-speed data processing, and advanced connectivity features. -
Package
The XC7K70T-1FBG676I chip is a Ball Grid Array (BGA) package type, with a form factor of 676-pin and a size of 27mm x 27mm.
Datasheet PDF
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