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Xilinx XC7K410T-2FF676I

Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 29306880 406720 676-BBGA, FCBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC7K410T-2FF676I

Datasheet: XC7K410T-2FF676I Datasheet (PDF)

Package/Case: FBGA676

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3688 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC7K410T-2FF676I General Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 29306880 406720 676-BBGA, FCBGA

Features

IC FPGA 400 I/O 676FCBGAIC FPGA 400 I/O 676FCBGA
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Pin Count 676 Package Category BGA
Released Date Jan 8, 2023

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC7K410T-2FF676I chip is a product manufactured by Xilinx, a leading provider of programmable logic devices. It belongs to the 7 series of FPGAs and is built with advanced 28nm process technology. This chip offers high-performance computing capabilities, excellent system integration features, and a large number of programmable logic cells. It is commonly used in various applications, including telecommunications, industrial automation, automotive, and aerospace sectors.
  • Features

    The XC7K410T-2FF676I is a part of Xilinx's Kintex-7 family of FPGAs. It has 410,000 logic cells, 5,120 KB of Block RAM, and 4,860 DSP48E1 slices. This device also features 34 GTX transceivers with a data rate of up to 6.6 Gbps.
  • Pinout

    The XC7K410T-2FF676I is a 676-pin FPGA from the Xilinx Kintex-7 family. It features a dual-core ARM Cortex-A9 processor and includes a range of I/Os such as high-speed serial interfaces, DDR3 memory controllers, and general-purpose I/O pins.
  • Manufacturer

    The manufacturer of the XC7K410T-2FF676I is Xilinx Inc. It is an American technology company that specializes in the development and production of programmable logic devices, software development tools, and intellectual property (IP) cores. Xilinx is known for its FPGA (Field-Programmable Gate Array) and SoC (System on a Chip) solutions, which provide flexible and customizable platforms for various applications in industries like aerospace, automotive, telecommunications, and more.
  • Application Field

    The XC7K410T-2FF676I is a field-programmable gate array (FPGA) and can be used in diverse application areas such as aerospace, defense, telecommunications, automotive, and high-performance computing. It offers high-speed processing capabilities, programmable logic functions, and flexible I/O interfaces, making it suitable for a wide range of applications in different industries.
  • Package

    The XC7K410T-2FF676I chip has a package type of FF676, a form factor of 676 pin flip-chip, and a size of approximately 27mm x 27mm.

Datasheet PDF

Preliminary Specification XC7K410T-2FF676I PDF Download

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