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Xilinx XC7K325T-2FBG900C
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 16404480 326080 900-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K325T-2FBG900C
Datasheet: XC7K325T-2FBG900C Datasheet (PDF)
Package/Case: BGA900
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3018 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K325T-2FBG900C General Description
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 16404480 326080 900-BBGA, FCBGA
Features
IC FPGA 500 I/O 900FCBGAIC FPGA 500 I/O 900FCBGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pbfree Code | Yes | Rohs Code | Yes |
| Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
| Part Package Code | BGA | Pin Count | 900 |
| Reach Compliance Code | compliant | ECCN Code | 3A991.D |
| HTS Code | 8542.39.00.01 | Samacsys Manufacturer | XILINX |
| Clock Frequency-Max | 1818 MHz | Combinatorial Delay of a CLB-Max | 0.61 ns |
| JESD-30 Code | S-PBGA-B900 | JESD-609 Code | e1 |
| Length | 31 mm | Moisture Sensitivity Level | 4 |
| Number of CLBs | 25475 | Number of Inputs | 500 |
| Number of Logic Cells | 326080 | Number of Outputs | 500 |
| Number of Terminals | 900 | Operating Temperature-Max | 85 °C |
| Operating Temperature-Min | Organization | 25475 CLBS | |
| Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
| Package Equivalence Code | BGA900,30X30,40 | Package Shape | SQUARE |
| Package Style | GRID ARRAY | Peak Reflow Temperature (Cel) | 245 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
| Seated Height-Max | 2.54 mm | Supply Voltage-Max | 1.03 V |
| Supply Voltage-Min | 0.97 V | Supply Voltage-Nom | 1 V |
| Surface Mount | YES | Technology | CMOS |
| Temperature Grade | OTHER | Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL | Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 31 mm |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7K325T-2FBG900C is a high-performance FPGA (Field-Programmable Gate Array) chip manufactured by Xilinx. It belongs to the Kintex-7 family of FPGAs and features 325,000 logic cells. With advanced features and high processing capabilities, this chip is suitable for a wide range of applications, including telecommunications, aerospace, industrial automation, and more.
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Equivalent
There are no direct equivalent products to the XC7K325T-2FBG900C chip as it is a unique component. However, other similar chips in the Xilinx Kintex-7 family may provide similar features and capabilities. -
Features
The XC7K325T-2FBG900C is a field-programmable gate array (FPGA) device manufactured by Xilinx. It belongs to the Virtex-7 family and features 324,000 logic cells, 552,960 effective flip-flops, and 3,600 Kbits of BRAM, making it suitable for high-performance applications in various industries. -
Pinout
The XC7K325T-2FBG900C is an FPGA (Field-Programmable Gate Array) device with 900 pins. It belongs to the Xilinx Kintex-7 series and offers a variety of functions such as digital signal processing, industrial automation, video surveillance, and network processing. -
Manufacturer
The manufacturer of the XC7K325T-2FBG900C is Xilinx Inc. It is a technology company specializing in the development and production of programmable semiconductor devices. Xilinx is one of the leading manufacturers of field-programmable gate arrays (FPGAs) and offers various solutions for a wide range of industries including aerospace, automotive, telecommunications, and data centers. -
Application Field
The XC7K325T-2FBG900C FPGA (Field Programmable Gate Array) can be used in a range of application areas, including aerospace and defense, automotive, telecommunications, industrial automation, medical, and scientific research. It offers high-performance computing capabilities, advanced signal processing, and flexible I/O options, making it suitable for various complex and demanding applications. -
Package
The XC7K325T-2FBG900C chip is a 900-ball, 0.8mm pitch, 31mm x 31mm package with a FCBGA (Flip Chip Ball Grid Array) form.
Datasheet PDF
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