Xilinx XC7A50T-2FGG484I

Part points

• The XC7A50T-2FGG484I chip is a field-programmable gate array (FPGA) device manufactured by Xilinx. It belongs to the Xilinx 7 series and has a capacity of 50,000 logic cells. The chip uses a specific FGGBGA484 package for mounting and connectivity. It is designed for various applications that require reconfigurable hardware and high-performance computing.

• Equivalent

  Some equivalent products of the XC7A50T-2FGG484I chip are the XC7A50T-2CSG325I and XC7A50T-2FGG484C chips, which have similar features and capabilities. These chips are part of the Xilinx Artix-7 FPGA series and come in different packages for different application requirements.

• Features

  The XC7A50T-2FGG484I is an FPGA (Field-Programmable Gate Array) device. It has 52,160 logic cells, 1,920 KB of internal memory, and 32 DSP slices. It operates on a 1.2V core voltage and has multiple I/O standards, including LVCMOS, LVDS, and HSTL. It also supports high-speed serial connectivity with up to 6.6 Gb/s data rates.

• Pinout

  The XC7A50T-2FGG484I has a pin count of 484 and is a part of the Xilinx Artix-7 FPGA family. It offers a range of I/O capabilities and specific functions such as programmable logic, block RAM, and DSP processing.

• Manufacturer

  The manufacturer of the XC7A50T-2FGG484I is Xilinx. Xilinx is a semiconductor company that specializes in the design and production of field-programmable gate arrays (FPGAs) and related technologies.

• Application Field

  The XC7A50T-2FGG484I is an FPGA (Field-Programmable Gate Array) that can be used in various application areas including telecommunications, aerospace and defense, automotive, industrial automation, and consumer electronics. It can be programmed to perform a wide range of tasks from signal processing to control and interface functions.

• Package

  The XC7A50T-2FGG484I chip comes in a Flip-chip Ball Grid Array (FCBGA) package with 484 solder balls. Its size is approximately 23 mm x 23 mm.