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Xilinx XC7A100T-1CSG324I

FPGA - Field Programmable Gate Array XC7A100T-1CSG324I

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC7A100T-1CSG324I

Datasheet: XC7A100T-1CSG324I Datasheet (PDF)

Package/Case: BGA-324

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2008 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC7A100T-1CSG324I General Description

Fpga, Artix-7, 210 I/O, Csbga-324; No. Of Logic Blocks:15850; No. Of Macrocells:101440; Fpga Family:Artix-7; Logic Case Style:Csbga; No. Of Pins:324Pins; No. Of Speed Grades:1; Total Ram Bits:4860Kbit; No. Of I/O S:210I/O S; Clock Rohs Compliant: Yes |Amd Xilinx XC7A100T-1CSG324I

Features

IC FPGA ARTIX7 210 I/O 324CSBGAIC FPGA ARTIX7 210 I/O 324CSBGA
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Pin Count 324 Package Category BGA
Released Date Oct 1, 2021

Shipping

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DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
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TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Payment

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Credit Card Credit Card charge 3.5% service fee.
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Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC7A100T-1CSG324I is a programmable Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It belongs to the Artix-7 family and has a capacity of 101,440 logic cells. The chip offers a wide range of features and connectivity options, making it suitable for various applications, including embedded systems, networking, and automotive electronics.
  • Equivalent

    Some equivalent products to the XC7A100T-1CSG324I chip include: 1. XC7A100T-1FGG484I 2. XC7A100T-1FGG400C 3. XC7A100T-1FGG676I 4. XC7A100T-1CSG324I-ND 5. XC7A100T-1CSG324C 6. XC7A100T-2FGG484I 7. XC7A100T-2FGG676I 8. XC7A100T-2FGG484I-ND
  • Features

    The XC7A100T-1CSG324I is an FPGA (Field-Programmable Gate Array) device. It has 101,440 logic cells, 240 DSP slices, 6.6 Mb of block RAM, and 4.9 Gbps of transceiver bandwidth. It operates on a supply voltage of 0.95V to 1.05V. It also supports various communication protocols and has a high-speed interface for data transfer.
  • Pinout

    The XC7A100T-1CSG324I is an FPGA chip with a pin count of 324. It is a member of the Xilinx Artix-7 family and offers a variety of functions such as programmable logic, embedded processors, and high-speed transceivers, making it suitable for a range of applications in communication, industrial, and consumer electronics.
  • Manufacturer

    The manufacturer of the XC7A100T-1CSG324I is Xilinx Inc. It is an American technology company that specializes in programmable logic devices and related software tools.
  • Application Field

    The XC7A100T-1CSG324I is a field-programmable gate array (FPGA) that can be used in a variety of application areas, including embedded computing, industrial automation, telecommunications, automotive electronics, and high-performance computing. With its high logic cell count, high-speed I/O interfaces, and programmability, this FPGA can provide flexible and customizable solutions for different industries.
  • Package

    The XC7A100T-1CSG324I chip is housed in a large-scale integrated circuit package with a Ball Grid Array (BGA) form. It has 324 solder balls arranged in a grid pattern around the bottom surface. The chip's dimensions are 13x13mm, making it compact and suitable for use in various electronic applications.

Datasheet PDF

Preliminary Specification XC7A100T-1CSG324I PDF Download

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