Xilinx XC7A100T-1CSG324I
FPGA - Field Programmable Gate Array XC7A100T-1CSG324I
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7A100T-1CSG324I
Datasheet: XC7A100T-1CSG324I Datasheet (PDF)
Package/Case: BGA-324
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2008 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7A100T-1CSG324I General Description
Fpga, Artix-7, 210 I/O, Csbga-324; No. Of Logic Blocks:15850; No. Of Macrocells:101440; Fpga Family:Artix-7; Logic Case Style:Csbga; No. Of Pins:324Pins; No. Of Speed Grades:1; Total Ram Bits:4860Kbit; No. Of I/O S:210I/O S; Clock Rohs Compliant: Yes |Amd Xilinx XC7A100T-1CSG324I
Features
IC FPGA ARTIX7 210 I/O 324CSBGAIC FPGA ARTIX7 210 I/O 324CSBGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 324 | Package Category | BGA |
Released Date | Oct 1, 2021 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
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Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC7A100T-1CSG324I is a programmable Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It belongs to the Artix-7 family and has a capacity of 101,440 logic cells. The chip offers a wide range of features and connectivity options, making it suitable for various applications, including embedded systems, networking, and automotive electronics.
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Equivalent
Some equivalent products to the XC7A100T-1CSG324I chip include: 1. XC7A100T-1FGG484I 2. XC7A100T-1FGG400C 3. XC7A100T-1FGG676I 4. XC7A100T-1CSG324I-ND 5. XC7A100T-1CSG324C 6. XC7A100T-2FGG484I 7. XC7A100T-2FGG676I 8. XC7A100T-2FGG484I-ND -
Features
The XC7A100T-1CSG324I is an FPGA (Field-Programmable Gate Array) device. It has 101,440 logic cells, 240 DSP slices, 6.6 Mb of block RAM, and 4.9 Gbps of transceiver bandwidth. It operates on a supply voltage of 0.95V to 1.05V. It also supports various communication protocols and has a high-speed interface for data transfer. -
Pinout
The XC7A100T-1CSG324I is an FPGA chip with a pin count of 324. It is a member of the Xilinx Artix-7 family and offers a variety of functions such as programmable logic, embedded processors, and high-speed transceivers, making it suitable for a range of applications in communication, industrial, and consumer electronics. -
Manufacturer
The manufacturer of the XC7A100T-1CSG324I is Xilinx Inc. It is an American technology company that specializes in programmable logic devices and related software tools. -
Application Field
The XC7A100T-1CSG324I is a field-programmable gate array (FPGA) that can be used in a variety of application areas, including embedded computing, industrial automation, telecommunications, automotive electronics, and high-performance computing. With its high logic cell count, high-speed I/O interfaces, and programmability, this FPGA can provide flexible and customizable solutions for different industries. -
Package
The XC7A100T-1CSG324I chip is housed in a large-scale integrated circuit package with a Ball Grid Array (BGA) form. It has 324 solder balls arranged in a grid pattern around the bottom surface. The chip's dimensions are 13x13mm, making it compact and suitable for use in various electronic applications.
Datasheet PDF
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