Xilinx XC6VLX75T-2FFG784C

Part points

• XC6VLX75T-2FFG784C is a programmable logic device from Xilinx. It belongs to the Virtex-6 family and offers advanced features like high performance, low power consumption, and flexibility. This chip provides ample resources for implementing complex digital designs and supports various application areas such as telecommunications, video processing, and aerospace. Its 784-pin BGA package makes it suitable for compact and high-density designs.

• Equivalent

  The equivalent products of the XC6VLX75T-2FFG784C chip from Xilinx are the XC6VLX75T-1FFG784C, XC6VHX75T-2FFG784, XC6VHX75T-1FFG784, XC6VSX75T-2FFG784, and XC6VSX75T-1FFG784.

• Features

  Some of the key features of the XC6VLX75T-2FFG784C FPGA include a logic capacity of 75,780 slices, a total number of 3,024,000 system gates, 14,400 Kb of distributed RAM, 61,344 bytes of block RAM, 600 MHz max clock frequency, and 784 pin package.

• Pinout

  The XC6VLX75T-2FFG784C is a field-programmable gate array (FPGA) with a pin count of 784. The specific functions of the pins on this device can be found in the product datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC6VLX75T-2FFG784C is Xilinx Inc. It is an American technology company known for its development of programmable logic devices, including field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs).

• Application Field

  The XC6VLX75T-2FFG784C is a FPGA (Field Programmable Gate Array) with 75,000 logic cells, used in various applications, including aerospace and defense, automotive, industrial automation, telecommunications, and video and image processing. It is capable of performing high-speed data processing, signal processing, and complex control functions.

• Package

  The XC6VLX75T-2FFG784C chip has a BGA package type, a 784-ball grid array (FFG784), and a form factor of 27 x 27 mm.