Xilinx XC6VLX130T-3FFG1156C
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 9732096 128000 1156-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC6VLX130T-3FFG1156C
Datasheet: XC6VLX130T-3FFG1156C Datasheet (PDF)
Package/Case: BGA-1156
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2736 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6VLX130T-3FFG1156C General Description
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 9732096 128000 1156-BBGA, FCBGA
Features
- XC6V: This indicates that it's part of the Virtex-6 family of FPGAs.
- LX130T: This indicates that it's a mid-range device with 130,000 logic cells and a high-speed serial transceiver.
- -3: This indicates the speed grade of the device, which is -3, meaning it can operate at a maximum frequency of 300 MHz.
- FFG1156C: This indicates the package type and pin count of the device.
Application
- 130,000 logic cells
- High-speed serial transceivers capable of up to 6.5 Gbps
- Up to 648 I/O pins
- Support for DDR2 and DDR3 memory interfaces
- Multiple power management features, including dynamic voltage and frequency scaling
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC6VLX130T |
Number of Logic Elements: | 128000 LE | Adaptive Logic Modules - ALMs: | 20000 ALM |
Embedded Memory: | 9.28 Mbit | Number of I/Os: | 600 I/O |
Supply Voltage - Min: | 1 V | Supply Voltage - Max: | 1 V |
Minimum Operating Temperature: | 0 C | Maximum Operating Temperature: | + 85 C |
Data Rate: | 6.6 Gb/s | Number of Transceivers: | 20 Transceiver |
Mounting Style: | SMD/SMT | Package / Case: | FCBGA-1156 |
Brand: | Xilinx | Distributed RAM: | 1740 kbit |
Embedded Block RAM - EBR: | 9504 kbit | Maximum Operating Frequency: | 1600 MHz |
Moisture Sensitive: | Yes | Number of Logic Array Blocks - LABs: | 10000 LAB |
Operating Supply Voltage: | 1 V | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 1 | Subcategory: | Programmable Logic ICs |
Tradename: | Virtex |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC6VLX130T-3FFG1156C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : High-speed
Brands :
Package :
Description : communications
Part Number : Aerospace
Brands :
Package :
Description : and defense
Part points
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The XC6VLX130T-3FFG1156C chip is a high-performance field-programmable gate array (FPGA) developed by Xilinx. It is part of the Virtex-6 family and offers a range of features for various applications, such as telecommunications, aerospace, and industrial automation. With a large number of logic cells, high-speed interface capabilities, and advanced design tools, it provides flexibility and customization options for complex digital designs.
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Features
The XC6VLX130T-3FFG1156C is a field-programmable gate array (FPGA) by Xilinx. It features 131,072 logic cells, 1,650 DSP48E1 slices, 15.2 Mb of block RAM, 1,728 Kb of distributed RAM, and a maximum capacity of 113,600 slices. It operates at a nominal voltage of 1.0V and supports high-speed interfaces like Gigabit Ethernet, PCIe, and USB. -
Pinout
The XC6VLX130T-3FFG1156C is a Xilinx Virtex-6 FPGA with 1156 pins. It is a 130,000 logic cell device with a maximum of 1440 input/output pins and a maximum of 640 user I/O pins. It offers various functions and features including programmable logic, integrated hard blocks, memory interfaces, and high-speed serial connectivity. -
Manufacturer
The manufacturer of the XC6VLX130T-3FFG1156C is Xilinx. Xilinx is a multinational technology company known for developing and manufacturing high-performance programmable logic devices, field-programmable gate arrays (FPGAs), and application-specific integrated circuits (ASICs). They specialize in providing digital and mixed-signal solutions for a wide range of industries including automotive, aerospace, telecommunications, and data centers. -
Application Field
The XC6VLX130T-3FFG1156C FPGA (Field Programmable Gate Array) is commonly used in various applications including wireless communications, automotive, aerospace and defense, medical imaging, and high-performance computing. Its high logic capacity, performance, and flexibility make it suitable for complex applications that require high processing speeds and large data throughput. -
Package
The XC6VLX130T-3FFG1156C chip has a package type of Flip-Chip FineLine BGA (FFG), a form factor of BGA (Ball Grid Array), and a size of 1156 pins.
Datasheet PDF
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