Xilinx XC6VLX130T-2FFG784I
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 9732096 128000 784-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC6VLX130T-2FFG784I
Datasheet: XC6VLX130T-2FFG784I Datasheet (PDF)
Package/Case: BGA-784
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2612 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6VLX130T-2FFG784I General Description
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 9732096 128000 784-BBGA, FCBGA
Features
IC FPGA 400 I/O 784FCBGAIC FPGA 400 I/O 784FCBGASpecifications
Parameter | Value | Parameter | Value |
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Case/Package | FCBGA | Mount | Surface Mount |
Number of Pins | 784 | Max Operating Temperature | 100 °C |
Min Operating Temperature | -40 °C | Number of I/Os | 400 |
Number of Logic Blocks (LABs) | 10000 | Number of Logic Elements/Cells | 128000 |
Operating Supply Voltage | 1 V | RAM Size | 1.2 MB |
Speed Grade | 2 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6VLX130T-2FFG784I chip is a field-programmable gate array (FPGA) produced by Xilinx. It belongs to the Virtex-6 family and has 130,000 logic cells. The chip is designed for high-performance applications and offers advanced processing capabilities, high-speed I/O, and on-chip memory. It utilizes a 784-pin flip-chip package for easy integration onto circuit boards.
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Features
XC6VLX130T-2FFG784I is an advanced FPGA, with a Virtex-6 LX family, containing 131,520 logic cells and a maximum clock frequency of 550 MHz. It supports up to 2 million system gates, has an integrated USB2.0 interface, and offers a wide range of connectivity options like up to 784 user I/Os and gigabit Ethernet. -
Pinout
The XC6VLX130T-2FFG784I is an FPGA from Xilinx. It has a pin count of 784 and is in the FFG package. The specific pin functions and configurations can be found in the device datasheet provided by Xilinx. -
Manufacturer
The manufacturer of the XC6VLX130T-2FFG784I is Xilinx Inc. Xilinx is an American technology company specializing in the design and manufacture of programmable logic devices and associated software tools. It is known for its field-programmable gate array (FPGA) and programmable system-on-chip (SoC) solutions used in a wide range of applications across various industries. -
Application Field
The XC6VLX130T-2FFG784I is a Field-Programmable Gate Array (FPGA) that can be used in various application areas, including telecommunications, video processing, high-performance computing, and aerospace. With its high-performance capabilities and large capacity, it is suitable for applications that require complex logic implementation and high-speed processing. -
Package
The XC6VLX130T-2FFG784I chip has a flip-chip ball grid array (BGA) package type. It comes in a 784-pin package size.
Datasheet PDF
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