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Xilinx XC6VLX130T-2FFG784I

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 9732096 128000 784-BBGA, FCBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC6VLX130T-2FFG784I

Datasheet: XC6VLX130T-2FFG784I Datasheet (PDF)

Package/Case: BGA-784

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2612 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC6VLX130T-2FFG784I General Description

Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 400 9732096 128000 784-BBGA, FCBGA

Features

IC FPGA 400 I/O 784FCBGAIC FPGA 400 I/O 784FCBGA
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package FCBGA Mount Surface Mount
Number of Pins 784 Max Operating Temperature 100 °C
Min Operating Temperature -40 °C Number of I/Os 400
Number of Logic Blocks (LABs) 10000 Number of Logic Elements/Cells 128000
Operating Supply Voltage 1 V RAM Size 1.2 MB
Speed Grade 2

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC6VLX130T-2FFG784I chip is a field-programmable gate array (FPGA) produced by Xilinx. It belongs to the Virtex-6 family and has 130,000 logic cells. The chip is designed for high-performance applications and offers advanced processing capabilities, high-speed I/O, and on-chip memory. It utilizes a 784-pin flip-chip package for easy integration onto circuit boards.
  • Features

    XC6VLX130T-2FFG784I is an advanced FPGA, with a Virtex-6 LX family, containing 131,520 logic cells and a maximum clock frequency of 550 MHz. It supports up to 2 million system gates, has an integrated USB2.0 interface, and offers a wide range of connectivity options like up to 784 user I/Os and gigabit Ethernet.
  • Pinout

    The XC6VLX130T-2FFG784I is an FPGA from Xilinx. It has a pin count of 784 and is in the FFG package. The specific pin functions and configurations can be found in the device datasheet provided by Xilinx.
  • Manufacturer

    The manufacturer of the XC6VLX130T-2FFG784I is Xilinx Inc. Xilinx is an American technology company specializing in the design and manufacture of programmable logic devices and associated software tools. It is known for its field-programmable gate array (FPGA) and programmable system-on-chip (SoC) solutions used in a wide range of applications across various industries.
  • Application Field

    The XC6VLX130T-2FFG784I is a Field-Programmable Gate Array (FPGA) that can be used in various application areas, including telecommunications, video processing, high-performance computing, and aerospace. With its high-performance capabilities and large capacity, it is suitable for applications that require complex logic implementation and high-speed processing.
  • Package

    The XC6VLX130T-2FFG784I chip has a flip-chip ball grid array (BGA) package type. It comes in a 784-pin package size.

Datasheet PDF

Preliminary Specification XC6VLX130T-2FFG784I PDF Download

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