Xilinx XC6VLX130T-1FFG784C

Part points

• The XC6VLX130T-1FFG784C chip is a member of the Virtex-6 family of Field-Programmable Gate Arrays (FPGAs) manufactured by Xilinx. It offers advanced features like high-performance logic and DSP capabilities, providing a versatile solution for various applications such as telecommunications, aerospace, and defense. The chip features 130,000 logic cells and is housed in a 784-pin Fine-Pitch Ball Grid Array (FFG784C) package.

• Features

  XC6VLX130T-1FFG784C is an FPGA with a Virtex-6 LX FPGA family. It has 131,520 logic cells, 10,560 slices, and 600 CLB flip-flops. It provides 6.6 Gb/s transceivers, 8 GTP transceivers, and supports up to 1,600 DSP slices. Additionally, it has a 400 MHz system performance, high-speed serial connectivity, and versatile functionality for various applications.

• Pinout

  The XC6VLX130T-1FFG784C is an FPGA (Field-Programmable Gate Array) with a pin count of 784. It is from the Virtex-6 family and the FF signifies a flip-flop cell type. The device has a speed grade of 1 and offers a range of functions for digital circuit implementation and prototyping.

• Manufacturer

  The XC6VLX130T-1FFG784C is manufactured by Xilinx, Inc. It is an American technology company that specializes in the development of programmable logic solutions, especially field-programmable gate arrays (FPGAs).

• Application Field

  The application areas of the XC6VLX130T-1FFG784C FPGA include wireless communication, automotive systems, industrial control, video processing, aerospace and defense, and high-performance computing. This FPGA is versatile and can be used in a wide range of applications that require high-speed processing, low power consumption, and programmable logic capabilities.

• Package

  The XC6VLX130T-1FFG784C chip has a Ball Grid Array (BGA) package type, a 784-pin package form, and a size that adheres to the industry-standard JEDEC specifications for BGA packages.