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Xilinx XC6SLX75T-3FGG676C

FPGA - Field Programmable Gate Array XC6SLX75T-3FGG676C

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC6SLX75T-3FGG676C

Datasheet: XC6SLX75T-3FGG676C Datasheet (PDF)

Package/Case: BGA-676

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2846 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC6SLX75T-3FGG676C General Description

FPGA, SPARTAN-6, 348 I/O, FPBGA-676; No. of Logic Blocks:11662; No. of Macrocells:74637Macrocells; FPGA Family:Spartan-6; Logic Case Style:FBGA; No. of Pins:676Pins; No. of Speed Grades:3; Total RAM Bits:3096Kbit; MSL:- RoHS Compliant: Yes

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Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Y Product: Spartan-6
Number of Logic Elements: 74637 Number of I/Os: 348 I/O
Operating Supply Voltage: 1.2 V Minimum Operating Temperature: 0 C
Maximum Operating Temperature: + 85 C Mounting Style: SMD/SMT
Package / Case: FBGA-676 Data Rate: 800 Mb/s
Series: XC6SLX75T Brand: Xilinx
Distributed RAM: 692 kbit Embedded Block RAM - EBR: 3096 kbit
Maximum Operating Frequency: 1080 MHz Moisture Sensitive: Yes
Number of Transceivers: 8 Transceiver Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 40 Subcategory: Programmable Logic ICs
Tradename: Spartan Tags XC6SLX75T-3FGG, XC6SLX75T-3F, XC6SLX75T-3, XC6SLX75T, XC6SLX7, XC6SLX, XC6SL, XC6S, XC6
Case/Package BGA Mount Surface Mount
Number of Pins 676 Max Operating Temperature 85 °C
Min Operating Temperature 0 °C Number of I/Os 348
Number of Logic Blocks (LABs) 5831 Number of Logic Elements/Cells 74637
Number of Registers 93296 Number of Transceivers 8
Operating Supply Voltage 1.2 V RAM Size 387 kB
Speed Grade 3

Shipping

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Payment

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Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

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Part points

  • The XC6SLX75T-3FGG676C is a field-programmable gate array (FPGA) chip developed by Xilinx. It belongs to the Spartan-6 family and has a capacity of 75,000 logic cells. The "3FGG676C" designation refers to its package type and pin count. This chip offers high-performance computing capabilities and is widely used in various applications such as telecommunications, automotive, and industrial control systems.
  • Equivalent

    Some equivalent products to the XC6SLX75T-3FGG676C chip are: - XC6SLX75-3FGG676C - XC6SLX75T-3FGG484C - XC6SLX75T-3FGG484I - XC6SLX75-3FGG484C - XC6SLX75-2FGG484C - XC6SLX75C-2FGG484C.
  • Features

    The key features of the XC6SLX75T-3FGG676C include a high-performance FPGA with a speed grade of 3, 75,000 logic cells, 640 DSP slices, integrated memory, 6.6 Gbps serial transceivers, and support for advanced connectivity standards such as PCIe and Ethernet.
  • Pinout

    The XC6SLX75T-3FGG676C is a Field-Programmable Gate Array (FPGA) with a pin count of 676. It is part of the Spartan-6 LX family and operates at a speed grade of 3. It offers various features and functions, including programmable logic blocks, memory blocks, and multiple I/O options, making it suitable for a wide range of applications.
  • Manufacturer

    The manufacturer of XC6SLX75T-3FGG676C is Xilinx. Xilinx is a semiconductor company that specializes in designing and manufacturing high-performance and customizable integrated circuits for various applications, including data centers, telecommunications, automotive, industrial, and more.
  • Application Field

    The XC6SLX75T-3FGG676C is a field-programmable gate array (FPGA) chip with 75,000 logic cells. It can be used in various applications including wireless communications, high-speed data processing, video and image processing, industrial automation, and scientific instrumentation. Its versatility and performance make it suitable for a wide range of industry applications.
  • Package

    The XC6SLX75T-3FGG676C chip has a package type of BGA (Ball Grid Array), a form factor of 676 pins, and a size of 27x27 mm (10x10.5 mm die size).

Datasheet PDF

Preliminary Specification XC6SLX75T-3FGG676C PDF Download

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