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Xilinx XC6SLX75T-2FGG676I 48HRS

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 348 3170304 74637 676-BGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC6SLX75T-2FGG676I

Datasheet: XC6SLX75T-2FGG676I Datasheet (PDF)

Package/Case: BGA-676

RoHS Status:

Stock Condition: 2937 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $398.934 $398.934
200 $154.383 $30876.600
500 $148.957 $74478.500
1000 $146.277 $146277.000

In Stock:2937 PCS

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Quick Quote

Please submit RFQ for XC6SLX75T-2FGG676I or email to us: Email: [email protected], we will contact you within 12 hours.

XC6SLX75T-2FGG676I General Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 348 3170304 74637 676-BGA

xc6slx75t-2fgg676i

Features

  • 75,008 logic cells
  • 1.2V core voltage
  • 356 user I/O pins
  • Up to 840 Mb/s data transfer rate
  • Up to 622 I/O pins with built-in support for LVDS, RSDS, and HSTL I/O standards
  • Up to 576 Kb of block RAM
  • Up to 180 DSP slices
  • 8 global clock networks

Application

  • Aerospace and defense systems
  • Automotive systems
  • Broadcast equipment
  • Industrial control systems
  • Medical equipment
  • Video and image processing systems
  • Wired and wireless communication systems
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Tags XC6SLX75T-2FGG, XC6SLX75T-2F, XC6SLX75T-2, XC6SLX75T, XC6SLX7, XC6SLX, XC6SL, XC6S, XC6

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC6SLX75T-2FGG676I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC6SLX75-2FGG676I

Brands :  

Package :   BGA676

Description :   LFBGA676 ead free/RoHS Compliant

Part Number :   XC6SLX75T-3FGG676I

Brands :  

Package :   FBGA676

Description :   Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27MM, 1MM PITCH, LEAD FREE, FBGA-676

Part Number :   XC6SLX75T-4FGG676I

Brands :  

Package :  

Description :  

Part Number :   XC6SLX75-3FGG676I

Brands :  

Package :   FBGA676

Description :   Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676, 27 X 27MM, 1MM PITCH, LEAD FREE, FBGA-676

Part Number :   XC6SLX75-4FGG676I

Brands :  

Package :  

Description :  

Part points

  • The XC6SLX75T-2FGG676I chip is a field-programmable gate array (FPGA) from the Xilinx Spartan-6 family. It has 75,000 logic cells and is manufactured using a 45nm process technology. The chip offers high-performance and low-power consumption, making it suitable for various applications, including telecommunications, automotive, industrial, and consumer electronics.
  • Equivalent

    The equivalent products of the XC6SLX75T-2FGG676I chip are the XC6SLX75-2FGG676I, XC6SLX75T-2CSG484I, and XC6SLX75-2CSG484I chips.
  • Features

    XC6SLX75T-2FGG676I is a Xilinx Spartan-6 FPGA with 75,000 Logic Cells, 2.5V core voltage, FG676 package, and 676-ball Fine-Pitch Ball Grid Array configuration. It offers various embedded system features, including high-performance logic, DSP blocks, SelectIO technology, and multi-voltage I/O standards for flexibility and power optimization.
  • Pinout

    The XC6SLX75T-2FGG676I is an FPGA with a pin count of 676. It has various functions including logic gates, memory blocks, and I/O pins, which can be programmed to perform specific tasks based on the user's requirements.
  • Manufacturer

    The manufacturer of the XC6SLX75T-2FGG676I is Xilinx. It is a leading American technology company specializing in the development and production of field-programmable gate arrays (FPGAs). FPGAs are integrated circuits that can be reconfigured by customers to suit their specific needs, making them highly versatile and widely used in various industries such as telecommunications, automotive, and aerospace.
  • Application Field

    The XC6SLX75T-2FGG676I is a field-programmable gate array (FPGA) that can be used in various applications such as telecommunications, industrial automation, embedded systems, and image processing. It offers high-performance computing capabilities and flexible hardware customization, making it suitable for a wide range of applications that require real-time processing and high-speed data handling.
  • Package

    The XC6SLX75T-2FGG676I chip has a package type of Flip Chip Grid Array (FCGA), a form of a surface-mounted chip. Its size is 27 mm x 27 mm, with a 676-ball grid array (BGA) configuration.

Datasheet PDF

Preliminary Specification XC6SLX75T-2FGG676I PDF Download

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