Xilinx XC6SLX25T-3CSG324C

Part points

• The XC6SLX25T-3CSG324C chip is a member of the Spartan-6 family of field-programmable gate arrays (FPGAs) developed by Xilinx. It features a capacity of 24,640 logic cells and 448 kilobits of block RAM. With a 3-speed grade and 324-ball BGA package, this chip is designed for a broad range of applications in telecommunications, automotive, industrial, and consumer electronics sectors.

• Equivalent

  XC6SLX25T-3CSG324C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. Some equivalent products from other manufacturers include Altera Cyclone IV EP4CE25F23C7, Lattice iCE40HX1K, and Microsemi IGLOO2 M2GL025T-FCG324. These alternatives offer similar capabilities and can be used as alternatives to the XC6SLX25T-3CSG324C chip in different applications.

• Features

  The XC6SLX25T-3CSG324C is a Field Programmable Gate Array (FPGA) with a capacity of 25,920 logic cells and 720 Kbits of block RAM. It operates at a speed grade of 3 and is in a small form factor package (324-ffgc). It offers various features like integrated security, enhanced DSP capabilities, and high-speed connectivity options.

• Pinout

  The XC6SLX25T-3CSG324C is an FPGA from the Spartan-6 family with a pin count of 324 in a CSBGA package. It has 25,920 logic cells, 1,560 Kbits of memory, and operates at a speed grade of -3. The specific pin functions can be found in the device datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC6SLX25T-3CSG324C is Xilinx. It is a leading multinational technology company known for developing programmable logic devices and associated software.

• Application Field

  The XC6SLX25T-3CSG324C is a field-programmable gate array (FPGA) that can be used in a variety of applications, including telecommunications, data processing, media streaming, and embedded systems. Its versatility, low power consumption, and high-performance capabilities make it suitable for a wide range of industry sectors.

• Package

  The XC6SLX25T-3CSG324C chip utilizes the CS324 chip scale package (CSP). It has a 324-ball grid array (BGA) form factor and measures approximately 15mm x 15mm in size.