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Xilinx XC6SLX25-3CSG324I

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 226 958464 24051 324-LFBGA, CSPBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC6SLX25-3CSG324I

Datasheet: XC6SLX25-3CSG324I Datasheet (PDF)

Package/Case: 324-LFBGA

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3226 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for XC6SLX25-3CSG324I or email to us: Email: [email protected], we will contact you within 12 hours.

XC6SLX25-3CSG324I General Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 226 958464 24051 324-LFBGA, CSPBGA

Features

  • 25,120 logic cells
  • 1.2V core voltage
  • 3.2 Gbps maximum data rate
  • 144 user I/O pins
  • 324-ball, 0.5 mm pitch, chip-scale package (CSG324)

Application

  • Video and image processing
  • Communication systems
  • Automotive electronics
  • Industrial automation
  • Medical equipment
  • Aerospace and defense
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Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Y Product: Spartan-6
Number of Logic Elements: 24051 Number of I/Os: 226 I/O
Operating Supply Voltage: 1.2 V Minimum Operating Temperature: - 40 C
Maximum Operating Temperature: + 100 C Mounting Style: SMD/SMT
Package / Case: CSBGA-324 Series: XC6SLX25
Brand: Xilinx Distributed RAM: 229 kbit
Embedded Block RAM - EBR: 936 kbit Maximum Operating Frequency: 1080 MHz
Moisture Sensitive: Yes Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 126 Subcategory: Programmable Logic ICs
Tradename: Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC6SLX25-3CSG324I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC6SLX25-3FTG256C

Brands :  

Package :   BGA-256

Description :   FPGA Spartan?-6 LX Family 24051 Cells 45nm Technology 1.2V 256-Pin FTBGA

Part Number :   XC6SLX25-3FGG484C

Brands :  

Package :   BGA-484

Description :   FPGA Spartan®-6 LX Family 24051 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA

Part Number :   XC6SLX25-3FGG324C

Brands :  

Package :  

Description :  

Part Number :   XC6SLX25-3CSG225C

Brands :  

Package :  

Description :  

Part Number :   XC6SLX25-3CSG324C

Brands :  

Package :   324-LFBGA, CSPBGA

Description :   FPGA Spartan?-6 LX Family 24051 Cells 45nm Technology 1.2V 324-Pin CSBGA

Part points

  • The XC6SLX25-3CSG324I chip is a field-programmable gate array (FPGA) designed by Xilinx. It features a Spartan-6 FPGA architecture with 25,000 logic cells and a speed grade of -3. The chip comes in a 324-ball grid array package and has various I/O interfaces, making it suitable for a wide range of applications in fields like telecommunications, automotive, and aerospace.
  • Equivalent

    Some equivalent products to the XC6SLX25-3CSG324I chip include XC6SLX25-3FGG324I, XC6SLX25T-3CSG324I, and XC6SLX25T-3FGG324I.
  • Features

    XC6SLX25-3CSG324I is an electronic component with features such as a 25,408 logic cells and 673,920 bits of block RAM. It offers a maximum of 576 DSP 48 MAC/Slices, integrated PCI Express Endpoint Block and a generous amount of memory, making it suitable for a range of applications utilizing high-performance and low-power consumption requirements.
  • Pinout

    The XC6SLX25-3CSG324I is a Field-Programmable Gate Array (FPGA) with 324 pins. It has 25,920 logic cells and operates at a 3.3V voltage level. The specific functions of the pins depend on the user's programming and design implementation.
  • Manufacturer

    XC6SLX25-3CSG324I is an electronic component manufactured by Xilinx. Xilinx is a leading American technology company primarily focused on designing and producing programmable logic devices (PLDs) such as Field-Programmable Gate Arrays (FPGAs) and related development tools.
  • Application Field

    The XC6SLX25-3CSG324I is a field-programmable gate array (FPGA) device suitable for various applications including telecommunications, automotive, industrial automation, medical equipment, and aerospace. Its features like low power consumption, high-speed performance, and flexibility make it an ideal choice for applications that require advanced digital signal processing, data communication, and control system functionalities.
  • Package

    The XC6SLX25-3CSG324I chip has a package type of CS324 with a grid array. It has a size of 324 pins.

Datasheet PDF

Preliminary Specification XC6SLX25-3CSG324I PDF Download

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