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Xilinx XC6SLX16-3FTG256C
Product XC6SLX16-3FTG256C is an FPGA from the Spartan-6 LX family, featuring 14579 cells and utilizing 45nm CMOS technology at 1.2V
Brands: Xilinx
Mfr.Part #: XC6SLX16-3FTG256C
Datasheet: XC6SLX16-3FTG256C Datasheet (PDF)
Package/Case: FBGA-256
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2267 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6SLX16-3FTG256C General Description
The XC6SLX16-3FTG256C is a member of the Spartan-6 family of Field-Programmable Gate Arrays (FPGAs) produced by Xilinx. Here's a concise breakdown:1. **Family**: Spartan-62. **Model**: XC6SLX163. **Speed Grade**: -3 (This indicates the maximum frequency at which the device can operate)4. **Package**: FTG256C (This refers to the package type and pin count)5. **Capacity**: This model offers a logic capacity of up to 14,579 logic cells, 288Kb of block RAM, and 16 DSP slices, making it suitable for a range of applications.6. **Features**: It supports a variety of I/O standards, including LVCMOS, LVTTL, and SSTL. It also features built-in 3.3V power supplies and on-chip analog-to-digital converters (ADCs) for integration with analog sensors.7. **Applications**: Common applications include industrial automation, consumer electronics, telecommunications, automotive, and more.8. **Development Environment**: Xilinx provides development tools such as Vivado Design Suite to facilitate design, implementation, and verification of FPGA designs targeting this device.This FPGA offers a balance of performance, features, and flexibility, making it suitable for a wide range of embedded applications
Features
- FPGA Family: Spartan-6
- Logic Elements: 1472
- Embedded Memory: 36 Kb
- Maximum Number of Logic Cells: 1472
- Number of I/Os: 111
- Package: 256-pin FTBGA
- Maximum Speed Grade: -3
Application
- Data processing
- Communications
- Industrial automation
- Medical imaging
- Test and measurement equipment
- Military and aerospace
- Networking
- Video and image processing
- Embedded systems
- Signal processing
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC6SLX16 | Number of Logic Elements | 14579 LE |
| Adaptive Logic Modules - ALMs | 2278 ALM | Embedded Memory | 576 kbit |
| Number of I/Os | 186 I/O | Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | + 85 C | Mounting Style | SMD/SMT |
| Package / Case | FBGA-256 | Brand | Xilinx |
| Distributed RAM | 136 kbit | Embedded Block RAM - EBR | 576 kbit |
| Maximum Operating Frequency | 1.08 GHz | Moisture Sensitive | Yes |
| Number of Logic Array Blocks - LABs | 1139 LAB | Operating Supply Voltage | 1.2 V |
| Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
| Subcategory | Programmable Logic ICs | Tradename | Spartan |
| Unit Weight | 0.801483 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
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Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6SLX16-3FTG256C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Spartan-6 family and offers 16,640 logic cells and 768 Kbits of block RAM. It operates at a maximum frequency of 300 MHz and supports up to 214 input/output pins. It is commonly used in various applications such as low-power industrial control systems, automotive electronics, and wireless communication devices.
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Equivalent
Some equivalent products of the XC6SLX16-3FTG256C chip are: XC6SLX25-3FTG256C, XC6SLX16T-3FTG256C, XC6SLX16T-3FTG256C, XC6SLX25-3FTG256C, XC6SLX25T-3FTG256C, XC6SLX25-3FTG256C, XC6SLX25T-3FTG256C, XC6SLX25-3FTG256C, XC6SLX25T-3FTG256C. -
Features
The XC6SLX16-3FTG256C is an FPGA IC with 16,640 logic cells, 32 multiplexers, and 32 DSP48E1 slices. It operates at a maximum frequency of 450MHz and has 16-bit DDR2/3 memory interfaces. Additionally, it offers programmable clock management and I/O interfaces for various connectivity options. -
Pinout
The XC6SLX16-3FTG256C is a field-programmable gate array (FPGA) with a pin count of 256. It provides digital functions for various applications, such as signal processing, communication, and industrial control. -
Manufacturer
The manufacturer of the XC6SLX16-3FTG256C is Xilinx Inc. Xilinx is an American technology company specializing in programmable logic devices and related software tools. They are a leading provider of field-programmable gate arrays (FPGAs) and programmable systems-on-chip (SoCs) used in various industries such as automotive, aerospace, telecommunications, and more. -
Application Field
The XC6SLX16-3FTG256C is a field-programmable gate array (FPGA) commonly used in various applications such as digital signal processing, telecommunications, aerospace and defense, image and video processing, and industrial control systems. Its versatile nature and high-performance capabilities make it suitable for a wide range of applications. -
Package
The XC6SLX16-3FTG256C chip has a FTG256 package type, which is a FineLine BGA (Ball Grid Array) package with 256 solder balls. The chip measures approximately 17mm by 17mm in length and width.
Datasheet PDF
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