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Xilinx XC6SLX16-3CSG324I
XC6SLX16-3CSG324I Field Programmable Gate Array
Brands: Amd
Mfr.Part #: XC6SLX16-3CSG324I
Datasheet: XC6SLX16-3CSG324I Datasheet (PDF)
Package/Case: CSBGA-324
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3433 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6SLX16-3CSG324I General Description
The XC6SLX16-3CSG324I is a member of the Spartan-6 family of field-programmable gate arrays (FPGAs) manufactured by Xilinx. It features 16,000 logic cells and is built on a 45nm process technology. The "-3" in its name indicates that it operates with a nominal core supply voltage of 1.2V and supports a maximum operating frequency of up to 300MHz. The "CSG324" designation specifies the package type, indicating a 324-pin chip-scale package with a 0.5mm ball pitch, suitable for surface-mount applications. The "I" suffix signifies the industrial temperature range, typically spanning from -40°C to 100°C, ensuring reliable operation across various environmental conditions.This FPGA offers programmable logic, configurable I/Os, block RAM, and digital signal processing (DSP) slices, making it suitable for a wide range of applications including telecommunications, automotive, industrial automation, and consumer electronics. Its compact size, low power consumption, and versatility make it a popular choice for embedded system designers seeking flexibility and performance
Features
- Low power consumption
- 16,000 logic cells
- 324-pin CSBGA package
- 3.0V core voltage
- Integrated block RAM and DSP slices
- Flexible clocking options
- High-speed serial connectivity
- Programmable I/O standards
- Advanced configuration options
- Designed for high-performance applications
Application
- Telecommunications
- Networking
- Industrial control systems
- Medical devices
- Test and measurement equipment
- Automotive and avionics
- Computer peripherals
- Security systems
- Consumer electronics
- Video and imaging processing
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC6SLX16 | Number of Logic Elements | 14579 LE |
| Adaptive Logic Modules - ALMs | 2278 ALM | Embedded Memory | 576 kbit |
| Number of I/Os | 232 I/O | Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Mounting Style | SMD/SMT |
| Package / Case | CSBGA-324 | Brand | AMD / Xilinx |
| Distributed RAM | 136 kbit | Embedded Block RAM - EBR | 576 kbit |
| Maximum Operating Frequency | 1.08 GHz | Moisture Sensitive | Yes |
| Number of Logic Array Blocks - LABs | 1139 LAB | Operating Supply Voltage | 1.2 V |
| Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
| Subcategory | Programmable Logic ICs | Tradename | Spartan |
| Unit Weight | 1.554153 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6SLX16-3CSG324I chip is an FPGA (Field Programmable Gate Array) device manufactured by Xilinx. It belongs to the Spartan-6 LX family and has 16,640 logic cells and 558,240 bits of on-chip RAM. It operates at a speed grade of -3 and comes in a 324-ball CSBGA package. This chip is used in various applications, including embedded systems, telecommunications, aerospace, and industrial control.
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Equivalent
Potential equivalent products of the XC6SLX16-3CSG324I chip include the XC6SLX16-2CSG324I and XC6SLX16-4CSG324I. These chips are from the same series and have similar characteristics, but with different speed grades. -
Features
The features of XC6SLX16-3CSG324I FPGA include a logic cell array of 14,579 slices, each with four 6-input LUTs and eight flip-flops (FFs), DSP slices (with 180 multipliers and accumulators), 576Kbits of block RAM, 4 PLLs, and a maximum of 153 I/O pins. It operates at a speed grade of -3 and is in a 324-pin Small Form Factor Ball Grid Array (SFBGA) package. -
Pinout
The XC6SLX16-3CSG324I is a Field-Programmable Gate Array (FPGA) with a pin count of 324. It is from the Xilinx Spartan-6 LX family of FPGAs. The specific function of this model may vary, but generally, FPGAs are used for digital logic processing, data processing, and control applications. -
Manufacturer
The manufacturer of the XC6SLX16-3CSG324I is Xilinx. It is a semiconductor manufacturing company specializing in programmable devices, including field-programmable gate arrays (FPGAs) used in a wide range of applications such as aerospace, automotive, telecommunications, and industrial sectors. -
Application Field
The XC6SLX16-3CSG324I is a field-programmable gate array (FPGA) that is commonly used in various application areas such as telecommunications, automotive, industrial automation, medical equipment, and wireless networking. It offers high-speed processing capabilities, large memory resources, and versatile I/O options, making it suitable for a wide range of applications. -
Package
The XC6SLX16-3CSG324I chip has a package type of CS324 and its form is BGA (Ball Grid Array). The size of the chip is 17 x 17 mm.
Datasheet PDF
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