Xilinx XC6SLX150T-3FGG900I
FBGA-900(31x31) CPLDs/FPGAs
Brands: Amd
Mfr.Part #: XC6SLX150T-3FGG900I
Datasheet: XC6SLX150T-3FGG900I Datasheet (PDF)
Package/Case: FBGA-900
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2898 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6SLX150T-3FGG900I General Description
The XC6SLX150T-3FGG900I is a field-programmable gate array (FPGA) developed by Xilinx. It belongs to the Spartan-6 family of FPGAs and features a high logic density, making it suitable for a wide range of applications requiring high-performance computing.This specific model, the XC6SLX150T-3FGG900I, has a logic capacity of 147,443 logic cells and 9,216 slices. It also includes 900 I/O pins, which provide ample connectivity options for interfacing with external devices and peripherals. The FPGA operates at a maximum speed grade of -3, meaning it can run at clock speeds of up to 550 MHz, allowing for fast and efficient processing of data.Furthermore, the XC6SLX150T-3FGG900I includes various advanced features such as embedded block RAM, digital clock managers, and phase-locked loops (PLLs) to assist in optimizing performance and power consumption. It also offers a wide range of configurable I/O standards and voltages, making it flexible and adaptable to different system requirements.
Features
- XC6SLX150T-3FGG900I is a member of Spartan-6 Family
- It has 147,443 logic cells and 6,048 Kbits of Block RAM
- Offers 42,500 logic slices, each with four 6-input LUTs and 8 flip-flops
- Includes 600 MHz maximum operating frequency
- Supports a wide range of I/O standards
Application
- Telecommunications
- Networking equipment
- Industrial control systems
- Test and measurement equipment
- Medical imaging
- Defense and aerospace applications
- Automotive electronics
- Video and image processing
- Consumer electronics
- High-performance computing
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
Series | XC6SLX150T | Number of Logic Elements | 147443 LE |
Adaptive Logic Modules - ALMs | 23038 ALM | Embedded Memory | 4.71 Mbit |
Number of I/Os | 540 I/O | Supply Voltage - Min | 1.14 V |
Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 100 C | Data Rate | 3.2 Gb/s |
Number of Transceivers | 8 Transceiver | Mounting Style | SMD/SMT |
Package / Case | FBGA-900 | Brand | AMD / Xilinx |
Distributed RAM | 1355 kbit | Embedded Block RAM - EBR | 4824 kbit |
Maximum Operating Frequency | 1.08 GHz | Moisture Sensitive | Yes |
Number of Logic Array Blocks - LABs | 11519 LAB | Operating Supply Voltage | 1.2 V |
Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
Subcategory | Programmable Logic ICs |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6SLX150T-3FGG900I chip is a field-programmable gate array (FPGA) from Xilinx, a leading manufacturer of programmable logic devices. It offers 147,443 logic cells, advanced DSP capabilities, and high-speed serial connectivity options. This FPGA chip is commonly used in various applications, including telecommunications, industrial automation, aerospace, and defense.
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Equivalent
Some equivalent products to the XC6SLX150T-3FGG900I chip include XCS6SLX150T-3FGG900I, XC6SLX150TG-3FGG900I, XC6SLX150T-3FFG900I, XC6SLX150T-3CSG484I, and XC6SLX150T-3CSG484C. These chips belong to the Xilinx Spartan-6 FPGA family and have similar specifications and functionalities. -
Features
The XC6SLX150T-3FGG900I is an FPGA with a maximum logic cell capacity of 147,443 and 6.4 Mb of internal RAM. It operates at a maximum frequency of 400 MHz and has 381 input/output pins. It supports various standard interfaces, including PCIe, Gigabit Ethernet, and USB 2.0. -
Pinout
The XC6SLX150T-3FGG900I is a field-programmable gate array (FPGA) with a pin count of 900. It is a high-performance device designed for applications that require high logic capacity and high-speed performance. The specific functions of its pins may vary depending on the application and the design implemented using the FPGA. -
Manufacturer
The manufacturer of the XC6SLX150T-3FGG900I is Xilinx. It is a leading semiconductor company that specializes in the development and production of programmable logic devices, such as field-programmable gate arrays (FPGAs), and other related technologies. -
Application Field
The XC6SLX150T-3FGG900I is a high-end field-programmable gate array (FPGA) suitable for a wide range of applications including data center acceleration, wired communications, video and image processing, and high-performance computing. It offers high-speed serial connectivity, large capacity, and advanced digital signal processing capabilities. -
Package
The XC6SLX150T-3FGG900I chip is a field-programmable gate array (FPGA) and comes in a flip-chip grid array (FGG) package. The package size is of 900-pins.
Datasheet PDF
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