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Xilinx XC6SLX150-2FGG676C
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 498 4939776 147443 676-BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC6SLX150-2FGG676C
Datasheet: XC6SLX150-2FGG676C Datasheet (PDF)
Package/Case: BGA-676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2787 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6SLX150-2FGG676C General Description
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 498 4939776 147443 676-BGA
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | BGA | Mount | Surface Mount |
| Number of Pins | 676 | Max Operating Temperature | 85 °C |
| Min Operating Temperature | 0 °C | Number of I/Os | 498 |
| Number of Logic Blocks (LABs) | 11519 | Number of Logic Elements/Cells | 147443 |
| Number of Registers | 184304 | Operating Supply Voltage | 1.2 V |
| RAM Size | 603 kB |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6SLX150-2FGG676C is a programmable logic device (PLD) belonging to the Spartan-6 family of FPGAs (Field Programmable Gate Arrays). It comes in a 676-pin BGA (Ball Grid Array) package and is manufactured by Xilinx. The chip offers a high gate count, low power consumption, and a range of features to support various applications such as data processing, communications, and control systems.
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Equivalent
Some equivalent products of the XC6SLX150-2FGG676C chip include the XC6SLX100-2FGG676C, XC6SLX150-2FGG484C, XC6SLX100-2FGG484C, XC6SLX75-2FGG484C, and XC6SLX75-3FGG484C. -
Features
XC6SLX150-2FGG676C is a Field-Programmable Gate Array (FPGA) device from Xilinx. It offers 150,000 logic cells, 640 Digital Signal Processing (DSP) slices, and 8.4 Mb block RAM. It operates at a maximum speed of 550 MHz and supports multiple I/O standards. Additionally, it has various connectivity options and is suitable for a wide range of applications. -
Manufacturer
The manufacturer of the XC6SLX150-2FGG676C is Xilinx Inc. It is a semiconductor company specializing in field-programmable gate array (FPGA) devices. -
Application Field
The XC6SLX150-2FGG676C is a FPGA (Field-Programmable Gate Array) that can be used in various applications, including wireless communication, consumer electronics, automotive, industrial control, and aerospace. It offers high performance, low power consumption, and flexible design customization, making it suitable for a wide range of applications. -
Package
The package type of the XC6SLX150-2FGG676C chip is BGA (Ball Grid Array). The form refers to the physical shape of the chip, which is square. The size of the chip is 27x27 mm.
Datasheet PDF
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