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Xilinx XC6SLX150-2FGG484I

Field-Programmable Gate Array featuring 338 I/O Connections in a 484-pin Fine-pitch BGA

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC6SLX150-2FGG484I

Datasheet: XC6SLX150-2FGG484I Datasheet (PDF)

Package/Case: FCBGA-484

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3159 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC6SLX150-2FGG484I General Description

The XC6SLX150-2FGG484I is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-6 family, offering 147,443 logic cells and 9152 slices. The "-2" in its designation signifies a commercial temperature grade range, typically 0°C to 85°C. The "FGG484" indicates the package type, which is a Fine-Pitch Ball Grid Array (FBGA) with 484 pins. This package provides efficient routing and high I/O density. The "I" indicates that it is RoHS compliant, meaning it adheres to environmental standards by restricting the use of hazardous materials. With a maximum operating frequency of 450 MHz, it offers versatile programmable capabilities suitable for a wide range of applications including telecommunications, automotive, industrial automation, and consumer electronics. This FPGA also features advanced power management options, enabling efficient power consumption in various applications

xc6slx150-2fgg484i

Features

  • High-performance Xilinx Spartan-6 FPGA
  • 150,000 logic cells and 4,320 logic slices
  • 484-pin Fine-pitch Ball Grid Array package
  • 2.5V core voltage
  • Industrial-grade temperature range (-40°C to 100°C)
  • Integrated features include configurable block RAM and DSP slices

Application

  • Telecommunications: The XC6SLX150-2FGG484I can be used in telecommunications equipment for tasks such as signal processing and data packet manipulation.
  • Industrial Automation: This FPGA is suitable for industrial automation applications where high computing power and flexible I/O capabilities are required.
  • Defense and Aerospace: It can be used in defense and aerospace systems for functions like radar processing, image recognition, and communication encryption.
  • Medical Imaging: The XC6SLX150-2FGG484I can be used in medical imaging systems for tasks such as image reconstruction and analysis.
  • Automotive: This FPGA can be utilized in automotive applications for functions like advanced driver assistance systems and engine control.
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Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC6SLX150 Number of Logic Elements 147443 LE
Adaptive Logic Modules - ALMs 23038 ALM Embedded Memory 4.71 Mbit
Number of I/Os 338 I/O Supply Voltage - Min 1.14 V
Supply Voltage - Max 1.26 V Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 100 C Mounting Style SMD/SMT
Package / Case FCBGA-484 Brand AMD / Xilinx
Distributed RAM 1355 kbit Embedded Block RAM - EBR 4824 kbit
Maximum Operating Frequency 1.08 GHz Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 11519 LAB Operating Supply Voltage 1.2 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs Tradename Spartan
Unit Weight 1.121671 oz

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC6SLX150-2FGG484I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC6SLX150-2CSG484I

Brands :  

Package :   BGA484

Description :   Spartan-6 LX Family 147443 Cells 45nm (CMOS) Technology 1.2V

Part Number :   XC6SLX150-2FGG676I

Brands :  

Package :   FGGBGA-676

Description :   FPGA Spartan®-6 LX Family 147443 Cells 45nm (CMOS) Technology 1.2V 676-Pin FBGA

Part Number :   XC6SLX150-2FGG900I

Brands :  

Package :   BGA-900

Description :   FPGA

Part Number :   XC6SLX150-2FTG256C

Brands :  

Package :  

Description :  

Part Number :   XC6SLX150-2FTG256I

Brands :  

Package :  

Description :  

Part Number :   XC6SLX150-2FTG676C

Brands :  

Package :  

Description :  

Part Number :   XC6SLX150-2FTG676I

Brands :  

Package :  

Description :  

Part Number :   XC6SLX150-2FTG900C

Brands :  

Package :  

Description :  

Part Number :   XC6SLX150-2FTG900I

Brands :  

Package :  

Description :  

Part Number :   XC6SLX150-2FGG484C

Brands :  

Package :   FGGBGA-484

Description :   Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484, 23 X 23MM, 1MM PITCH, LEAD FREE, FBGA-484

Part points

  • XC6SLX150-2FGG484I is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Spartan-6 family and comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It offers 147,443 logic cells, up to 360 DSP48E1 slices, and up to 1586 Kbits of block RAM. The chip provides high-performance digital signal processing and is commonly used in applications like wireless communications, video processing, and industrial automation.

  • Equivalent

    Some equivalent products of the XC6SLX150-2FGG484I chip include Xilinx's XC6SLX150T-3FGG484I and XC6SLX150T-2FGG484I chips, which have similar specifications and functionalities.

  • Features

    The XC6SLX150-2FGG484I is a Xilinx Spartan-6 FPGA with 147,443 logic cells, 6,624 logic slices, and 864KB of block RAM. It operates at a maximum frequency of 400MHz and supports various I/O standards. It also includes various built-in features like clock management tiles, serial transceivers, and DSP slices for advanced functions.

  • Pinout

    The XC6SLX150-2FGG484I is an FPGA with 484 pins. It is part of the Spartan-6 family and has a function of performing programmable logic functions, with a logic cell count of 147,443. It also includes features such as embedded DSP slices, memory blocks, and high-speed I/O interfaces.

  • Manufacturer

    Xilinx, Inc. is the manufacturer of the XC6SLX150-2FGG484I. It is an American technology company specializing in the development and production of programmable logic devices and related software. Xilinx is one of the leading providers of field-programmable gate arrays (FPGAs) and has a wide range of applications in industries such as telecommunications, automotive, aerospace, and consumer electronics.

  • Application Field

    The XC6SLX150-2FGG484I is a Field-Programmable Gate Array (FPGA) chip typically used in applications like communication, data processing, industrial automation, and high-performance computing. It provides versatile programmable logic, high-speed interface capabilities, and low power consumption, making it suitable for various demanding designs and system requirements.

  • Package

    The package type of the XC6SLX150-2FGG484I chip is Fine-Pitch Ball Grid Array (FBGA). Its form is 484-pin grid array, and it is of size 484 pins.

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Datasheet PDF

Preliminary Specification XC6SLX150-2FGG484I PDF Download

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