Xilinx XC6SLX100T-3FGG676C

Part points

• The XC6SLX100T-3FGG676C is an FPGA (Field-Programmable Gate Array) chip manufactured by Xilinx. It belongs to the Spartan-6 family and features a logic capacity of 101,261 slices, embedded block RAM of 4,860 Kb, and 352 4-input lookup tables. It operates at a maximum frequency of 525 MHz and supports various communication protocols and interfaces. The chip is commonly used in applications such as video and image processing, communication, and industrial automation.

• Equivalent

  Some equivalent products to the XC6SLX100T-3FGG676C chip include the Xilinx XC6SLX100T-3FGG484C, XC7K160T-3FFG676C, and the XC2VP7-6FGG676C chips. These chips offer similar functionality and may be suitable alternatives depending on the specific requirements of the application.

• Features

  The features of the XC6SLX100T-3FGG676C FPGA include a capacity of 101,261 logic cells, 218 user I/Os, integrated high-speed transceivers, up to 108 multipliers, 36Kbits of block RAM, SelectIO technology for interfacing to external devices, and a maximum clock frequency of 600MHz.

• Pinout

  The XC6SLX100T-3FGG676C is a Field Programmable Gate Array (FPGA) with a pin count of 676 and belongs to the Spartan-6 LX family. It has various I/O functionality and can be programmed to perform different tasks based on user requirements.

• Manufacturer

  The manufacturer of the XC6SLX100T-3FGG676C is Xilinx, Inc. Xilinx is a multinational technology company specializing in the development and manufacturing of field-programmable gate array (FPGA) and programmable logic devices (PLDs). They are a leading provider of these products for various industries, including telecommunications, automotive, aerospace, and defense.

• Application Field

  The XC6SLX100T-3FGG676C is a field-programmable gate array (FPGA) that can be used in various application areas, including telecommunications, aerospace and defense, automotive, industrial automation, and medical devices. It offers high-performance processing, efficient power consumption, and flexibility for implementing complex digital systems.

• Package

  The XC6SLX100T-3FGG676C chip is a Field Programmable Gate Array (FPGA) with a BGA (Ball Grid Array) package. Its form is a Grid Array, and its size is 676-ball.