Xilinx XC6SLX100-3FGG676C
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 480 4939776 101261 676-BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC6SLX100-3FGG676C
Datasheet: XC6SLX100-3FGG676C Datasheet (PDF)
Package/Case: BGA-676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3190 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6SLX100-3FGG676C General Description
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 480 4939776 101261 676-BGA
Specifications
Parameter | Value | Parameter | Value |
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Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Y | Product: | Spartan-6 |
Number of Logic Elements: | 101261 | Number of I/Os: | 480 I/O |
Operating Supply Voltage: | 1.2 V | Minimum Operating Temperature: | 0 C |
Maximum Operating Temperature: | + 85 C | Mounting Style: | SMD/SMT |
Package / Case: | FBGA-676 | Series: | XC6SLX100 |
Brand: | Xilinx | Distributed RAM: | 976 kbit |
Embedded Block RAM - EBR: | 4824 kbit | Maximum Operating Frequency: | 1080 MHz |
Moisture Sensitive: | Yes | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 40 | Subcategory: | Programmable Logic ICs |
Tradename: | Spartan | Tags | XC6SLX100-3FGG, XC6SLX100-3F, XC6SLX100-3, XC6SLX10, XC6SLX1, XC6SLX, XC6SL, XC6S, XC6 |
Case/Package | BGA | Mount | Surface Mount |
Number of Pins | 676 | Max Operating Temperature | 85 °C |
Min Operating Temperature | 0 °C | Number of I/Os | 480 |
Number of Logic Blocks (LABs) | 7911 | Number of Logic Elements/Cells | 101261 |
Number of Registers | 126576 | Operating Supply Voltage | 1.2 V |
RAM Size | 603 kB |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6SLX100-3FGG676C chip is a Field Programmable Gate Array (FPGA) developed by Xilinx. It belongs to the Spartan-6 family and has a density of 100,000 logic cells. The chip operates at a speed grade of -3 and comes in a 676-ball grid array package (FGG676C). It can be programmed to perform various tasks and is commonly used in applications such as telecommunications, video processing, and embedded systems.
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Equivalent
Some equivalent products of the XC6SLX100-3FGG676C chip include XC6SLX100T-3FGG676C, XC6SLX100T-2FGG676C, and XC6SLX100-2FGG676C. These chips have similar specifications and features, making them potential alternatives for the XC6SLX100-3FGG676C. -
Features
The features of XC6SLX100-3FGG676C include a 100,000 logic cell capacity, fast 3.0 ns pin-to-pin logic delay, support for up to 672 I/O pins, integrated power management, and a 65 nm technology for reduced power consumption. It also has a FG speed grade and a 676-pin fine-pitch ball grid array (FBGA) package. -
Pinout
The XC6SLX100-3FGG676C is a field-programmable gate array (FPGA) with a pin count of 676. It is used for high-performance applications and offers 100,000 logic cells. The specific pin functions can vary depending on the user's design requirements and configuration. -
Manufacturer
The manufacturer of the XC6SLX100-3FGG676C is Xilinx. Xilinx is a technology company that specializes in developing and manufacturing programmable logic devices (PLDs), including field-programmable gate arrays (FPGAs) and programmable system-on-chip (SoC) devices. They offer solutions for a wide range of industries including telecommunications, automotive, aerospace, and more. -
Application Field
The XC6SLX100-3FGG676C is a field-programmable gate array (FPGA) that is commonly used in applications such as telecommunications, industrial automation, high-speed computing, and aerospace. It can be used for tasks such as signal processing, image and video processing, encryption, and control systems. -
Package
The XC6SLX100-3FGG676C chip has a package type of FG676, a form of BGA, and a size of 27 mm x 27 mm.
Datasheet PDF
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