Xilinx XC6SLX100-2CSG484I

Part points

• The XC6SLX100-2CSG484I chip is a Field-Programmable Gate Array (FPGA) from Xilinx. It is part of the Spartan-6 family and comes in a 484-ball grid array package. This chip offers a range of programmable logic features and is designed for applications that require high-performance processing, low power consumption, and flexibility for design changes. It is widely used in industries such as telecommunications, automotive, aerospace, and consumer electronics.

• Equivalent

  Some equivalent products of the XC6SLX100-2CSG484I chip are XC6VLX100T-2FFG484I, XC6VLX130T-2FFG484I, XC6VLX75T-2FFG484I, and XC6VLX75T-2FFG784I. These chips are part of the Virtex-6 LX family from Xilinx, and they have comparable features and specifications to the XC6SLX100-2CSG484I.

• Features

  The XC6SLX100-2CSG484I is an FPGA designed by Xilinx. It has 101,261 logic cells, 360 DSP slices, and 6.32 Mbps global clock network. It supports DDR2, DDR3, and LPDDR memory interfaces, and has interfaces for PCIe, Ethernet, and USB. It operates at a maximum frequency of 550 MHz and has 100 I/Os.

• Pinout

  The XC6SLX100-2CSG484I is an FPGA with a pin count of 484. It is a member of the Spartan-6 LX family, offering 100,000 logic cells. The functions of the pins will vary based on the specific design and configuration of the FPGA.

• Manufacturer

  The manufacturer of the XC6SLX100-2CSG484I is Xilinx. Xilinx is a technology company specializing in the development and production of programmable logic devices and software tools for a wide range of applications, including aerospace, automotive, communications, and more. They are known for their field-programmable gate array (FPGA) and system-on-chip (SoC) solutions.

• Application Field

  The XC6SLX100-2CSG484I is a field-programmable gate array (FPGA) device that is commonly used in various application areas including telecommunications, automotive, industrial automation, and medical equipment. It is suitable for applications that require high-speed data processing, low power consumption, and high reliability.

• Package

  The XC6SLX100-2CSG484I chip is packaged in a 484-ball, 1mm pitch, 23x23mm, and 1.27mm ball grid array (BGA) package.