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Xilinx XC5VSX95T-2FFG1136I

Advanced technology features

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC5VSX95T-2FFG1136I

Datasheet: XC5VSX95T-2FFG1136I Datasheet (PDF)

Package/Case: FBGA-1136

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3880 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for XC5VSX95T-2FFG1136I or email to us: Email: [email protected], we will contact you within 12 hours.

XC5VSX95T-2FFG1136I General Description

The XC5VSX95T-2FFG1136I is a member of the Xilinx Virtex-5 family, featuring a Xilinx FPGA (Field Programmable Gate Array) with 95,360 logic cells, making it suitable for complex digital designs. It operates with a maximum of 550 MHz clock frequency, providing high-speed processing capabilities. With 640 user I/O pins, it offers ample connectivity options for interfacing with external devices and systems. The device is housed in a 1136-pin flip-chip fine-pitch ball grid array (FFG1136), ensuring efficient heat dissipation and reliable electrical connections.The "-2" designation indicates a commercial-grade device, suitable for use in typical office environments with standard operating conditions.

xc5vsx95t-2ffg1136i

Features

  • Manufactured by Xilinx
  • XC5VSX95T-2FFG1136I model
  • 1136-pin flip chip package
  • Provides 95,360 logic cells
  • Offers 2436 Kb Block RAM
  • Includes 248 DSP slices
  • Supports various I/O standards
  • Ideal for high-performance applications
  • Equipped with advanced features
xc5vsx95t-2ffg1136i

Application

  • High-performance computing
  • Digital signal processing
  • Industrial automation
  • Telecommunications
  • Networking
  • Video and image processing
  • Medical imaging
  • Defense and aerospace
  • Automotive electronics
  • Scientific research
Amd Inventory

Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC5VSX95T Number of Logic Elements 94208 LE
Adaptive Logic Modules - ALMs 14720 ALM Embedded Memory 8.58 Mbit
Number of I/Os 640 I/O Supply Voltage - Min 1 V
Supply Voltage - Max 1 V Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 100 C Data Rate 6.5 Gb/s
Number of Transceivers 16 Transceiver Mounting Style SMD/SMT
Package / Case FBGA-1136 Brand AMD / Xilinx
Distributed RAM 1520 kbit Embedded Block RAM - EBR 8784 kbit
Maximum Operating Frequency 550 MHz Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 7360 LAB Operating Supply Voltage 1 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC5VSX95T-2FFG1136I is a high-performance FPGA (Field Programmable Gate Array) chip manufactured by Xilinx. It belongs to the Virtex-5 family and has a capacity of 95,360 logic cells. It features advanced features such as high-speed interfaces, DSP capabilities, and embedded PowerPC processors. This chip is commonly used in applications requiring complex digital processing and high-speed data handling.
  • Equivalent

    The equivalent product of the XC5VSX95T-2FFG1136I chip is the XCV5VSX95T-2FFG1136I chip.
  • Features

    The XC5VSX95T-2FFG1136I is a field-programmable gate array (FPGA) with a total of 95,360 logic cells, 1.6Mb of distributed RAM, and 192 DSP slices. It operates at a maximum frequency of 550MHz and has a total of 588 user I/O pins and 10 high-speed transceivers.
  • Pinout

    The XC5VSX95T-2FFG1136I is an FPGA (Field-Programmable Gate Array) with 1136 pins. The specific function of each pin can be found in the device datasheet provided by Xilinx, the manufacturer of the FPGA.
  • Manufacturer

    The manufacturer of the XC5VSX95T-2FFG1136I is Xilinx Inc. It is an American technology company known for developing and designing programmable logic devices, particularly field-programmable gate arrays (FPGAs). Xilinx offers solutions for various industries, including aerospace, automotive, telecommunications, and data centers, enabling customers to deploy innovative applications and systems.
  • Application Field

    The XC5VSX95T-2FFG1136I is commonly used in various applications including aerospace and defense, communications, industrial automation, medical equipment, and scientific research. Its high-performance capabilities, programmability, and advanced features make it suitable for a wide range of demanding and compute-intensive tasks in these sectors.
  • Package

    The XC5VSX95T-2FFG1136I chip is available in a flip-chip package. It has a BGA (Ball Grid Array) form and a size of 1136 pins.

Datasheet PDF

Preliminary Specification XC5VSX95T-2FFG1136I PDF Download

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