Xilinx XC5VLX85-1FF676I
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 3538944 82944 676-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC5VLX85-1FF676I
Datasheet: XC5VLX85-1FF676I Datasheet (PDF)
Package/Case: 1136FCBGA
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2903 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC5VLX85-1FF676I General Description
Virtex®-5 LX Field Programmable Gate Array (FPGA) IC 440 3538944 82944 676-BBGA, FCBGA
Features
IC FPGA 440 I/O 676FCBGAIC FPGA 440 I/O 676FCBGASpecifications
Parameter | Value | Parameter | Value |
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Case/Package | FCBGA | Mount | Surface Mount |
Number of Pins | 676 | Max Operating Temperature | 100 °C |
Min Operating Temperature | -40 °C | Number of I/Os | 440 |
Number of Logic Blocks (LABs) | 6480 | Number of Logic Elements/Cells | 82944 |
Operating Supply Voltage | 1 V | RAM Size | 432 kB |
Speed Grade | 1 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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XC5VLX85-1FF676I is a high-performance FPGA chip manufactured by Xilinx. It offers 84,960 logic cells and various input/output options, making it suitable for complex applications in industries like telecommunications, aerospace, and automotive. The chip comes with advanced features like dynamic power management and system-level debugging capabilities, providing flexibility and reliability in designing and implementing custom digital circuits.
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Features
The XC5VLX85-1FF676I is an FPGA (Field-Programmable Gate Array) device from Xilinx. Some of its key features include 85,000 logic cells, high-speed serial connectivity with up to 600 Mb/s data rate, memory interfaces, and advanced DSP capabilities. It also offers a large amount of internal storage, low power consumption, and various configuration options for flexibility in design. -
Pinout
The XC5VLX85-1FF676I is a FPGA (Field-Programmable Gate Array) with 676 pins. It is used for configurable digital logic and signal processing applications. The specific pin functions and assignments can be found in the device's datasheet. -
Manufacturer
The manufacturer of the XC5VLX85-1FF676I is Xilinx Inc. It is an American technology company specializing in the design and production of programmable logic devices and associated software tools. -
Application Field
The XC5VLX85-1FF676I is a Field-Programmable Gate Array (FPGA) chip suitable for various application areas such as telecommunications, aerospace and defense, industrial automation, medical devices, and scientific research. It can be utilized for complex digital signal processing, high-performance computing, image and video processing, networking, and data centers. -
Package
The XC5VLX85-1FF676I chip has a 676-pin BGA package type, with a form factor of flip-chip and a size of 27x27 mm.
Datasheet PDF
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