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Xilinx XC4VLX25-10SFG363I 48HRS

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC4VLX25-10SFG363I

Datasheet: XC4VLX25-10SFG363I Datasheet (PDF)

Package/Case: BGA-363

RoHS Status:

Stock Condition: 2807 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $177.043 $177.043
30 $167.558 $5026.740

In Stock:2807 PCS

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Please submit RFQ for XC4VLX25-10SFG363I or email to us: Email: [email protected], we will contact you within 12 hours.

XC4VLX25-10SFG363I General Description

Virtex®-4 LX Field Programmable Gate Array (FPGA) IC 240 1327104 24192 363-FBGA, FCBGA

xc4vlx25-10sfg363i

Features

  • Features: The XC4VLX25-10SFG363I FPGA has 24,640 logic cells, 1,536 Kb of block RAM, 36 Digital Signal Processing (DSP) slices, and 360 input/output (I/O) pins. It operates at a maximum clock frequency of 450 MHz and has a 10 nanoseconds (ns) minimum cycle time. It uses a 1.0V core voltage and 2.5V or 3.3V I/O voltage.

  • Applications: FPGAs are used in a wide range of applications, including aerospace, automotive, industrial automation, medical devices, and telecommunications. Specific applications for the XC4VLX25-10SFG363I FPGA may include digital signal processing, image processing, video processing, and control systems.

  • Equivalent Parts number list: Some equivalent parts to the XC4VLX25-10SFG363I FPGA include Altera/Intel's EP4VLX25 FPGA and Lattice Semiconductor's LFXP25 FPGA. It's important to note that while these parts may have similar features, they may not be drop-in replacements and may require changes to the design to accommodate the differences in the devices.

AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package FCBGA Mount Surface Mount
Number of Pins 363 Max Operating Temperature 100 °C
Min Operating Temperature -40 °C Number of I/Os 240
Number of Logic Blocks (LABs) 2688 Number of Logic Elements/Cells 24192
Operating Supply Voltage 1.2 V RAM Size 162 kB
Speed Grade 10

Shipping

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DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
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TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Payment

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Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

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  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • XC4VLX25-10SFG363I is a field-programmable gate array (FPGA) chip, developed by Xilinx. It belongs to the Virtex-4 LX series and features 25,000 logic cells along with various other advanced functionalities. The chip operates at a maximum speed grade of -10 and comes in a Fine-pitched Ball Grid Array (FBGA) package with 363 pins. It offers a versatile, reprogrammable hardware solution for complex digital designs in various applications.
  • Equivalent

    Equivalent products of the XC4VLX25-10SFG363I chip include the XC4VLX25-10FFG363I, XC4VLX25-10SF363I, and XC4VSX25-11FF363I chips.
  • Features

    The XC4VLX25-10SFG363I is a field-programmable gate array (FPGA) with a maximum gate count of 25,120 and contains 800 inputs and 400 outputs. It operates at a maximum frequency of 417 MHz and offers fast and efficient logic processing for various applications.
  • Pinout

    The XC4VLX25-10SFG363I has 363 pins. Its main function is that it is a Field Programmable Gate Array (FPGA) device designed for high-performance applications. It offers a range of configurable logic blocks along with digital signal processing capabilities, enabling flexible and efficient implementation of complex logic functions in various electronic systems.
  • Manufacturer

    The manufacturer of the XC4VLX25-10SFG363I is Xilinx Inc. It is a leading American technology company that specializes in designing and manufacturing programmable logic devices, including field-programmable gate arrays (FPGAs). Xilinx is known for enabling innovation in various industries such as aerospace, automotive, telecommunications, and data centers.
  • Application Field

    The XC4VLX25-10SFG363I is an FPGA (Field-Programmable Gate Array) device, commonly used in applications such as aerospace and defense, industrial automation, telecommunications, and high-performance computing. Its versatility and ability to be reprogrammed make it suitable for a wide range of applications requiring flexible and high-speed processing capabilities.
  • Package

    The XC4VLX25-10SFG363I chip is available in a 363-pin Flip Chip BGA (Ball Grid Array) package type. The form factor is Small Fine-Pitch Ball Grid Array (SFG) and the package size is 13 x 13 mm, or approximately 169 square millimeters.

Datasheet PDF

Preliminary Specification XC4VLX25-10SFG363I PDF Download

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