Xilinx XC4VLX15-10SF363I

Part points

• XC4VLX15-10SF363I is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It belongs to the Virtex-4 family and has a capacity of 15,408 logic cells. It operates at a maximum frequency of 250 MHz and is built on a 90nm process technology. This chip is commonly used in various applications including networking, telecommunications, and digital signal processing.

• Equivalent

  There are no direct equivalent products to the XC4VLX15-10SF363I chip. However, you may consider the Xilinx XC4VLX15-12SFG363I or the Altera EP4VLX15H7 as alternatives, as they have similar functionalities and features.

• Features

  The XC4VLX15-10SF363I is a Virtex-4 FPGA from Xilinx, featuring 15,000 logic cells, 624Kbits of RAM, and 720 I/O pins, with a maximum frequency of 700 MHz. It supports various communication protocols, offers programmable power management, and has embedded multipliers for high-speed arithmetic operations.

• Pinout

  The XC4VLX15-10SF363I is a FPGA chip with 363 pins. It is a Virtex-4 LX series FPGA from Xilinx, with a speed grade of 10. The specific function of the chip can vary depending on the design and programming, as FPGAs are reconfigurable hardware devices.

• Manufacturer

  The manufacturer of the XC4VLX15-10SF363I is Xilinx. Xilinx is a leading provider of programmable logic devices (PLDs), including field-programmable gate arrays (FPGAs). The company specializes in developing advanced integrated circuits that can be reprogrammed to perform specific functions, allowing for flexible customization and rapid prototyping in various industries such as aerospace, automotive, telecommunications, and more.

• Application Field

  The XC4VLX15-10SF363I is a field-programmable gate array (FPGA) designed for high-performance applications. Its application areas include telecommunications, networking, imaging, wireless communication, and digital signal processing. It offers a high level of flexibility and processing power, making it suitable for demanding applications that require real-time processing and high-speed data transmission.

• Package

  The XC4VLX15-10SF363I chip has a BGA (Ball Grid Array) package type, a 363-ball form, and a size that is compatible with the package type and form it uses.