Xilinx XC4VFX20-10FF672C
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 320 1253376 19224 672-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC4VFX20-10FF672C
Datasheet: XC4VFX20-10FF672C Datasheet (PDF)
Package/Case: FCBGA-672
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2263 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC4VFX20-10FF672C General Description
Virtex®-4 FX Field Programmable Gate Array (FPGA) IC 320 1253376 19224 672-BBGA, FCBGA
Features
- FPGA family: Virtex-4 FX
- Number of logic cells: 19,776
- Number of DSP slices: 20
- Number of block RAM: 1.1 Mb
- Number of configurable I/Os: 232
- Package: 672-pin flip-chip BGA
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Pin Count | 672 | Package Category | BGA |
Released Date | Feb 25, 2020 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC4VFX20-10FF672C chip is a field-programmable gate array (FPGA) by Xilinx. It offers 20,160 logic cells, 516 Kb of block RAM, and 36 DSP slices. It operates on a 1.2V power supply and supports a range of I/O standards. This chip can be reprogrammed to perform various functions in digital systems and is used in applications like video processing, networking, and telecommunications.
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Equivalent
There aren't any equivalent products for the XC4VFX20-10FF672C chip. It is a unique chip from Xilinx and does not have a direct equivalent from other manufacturers. -
Features
XC4VFX20-10FF672C is a programmable logic device belonging to the Xilinx Virtex-4 FX family. It features a gate count of 20,000, 672 ball grid array (BGA) package, and operates at a maximum speed grade of -10. It offers high-performance logic and memory resources, advanced clock management capabilities, and facilitates rapid prototyping and integration. -
Pinout
The XC4VFX20-10FF672C is a Field-Programmable Gate Array (FPGA) with a pin count of 672. It has various functions, including programmable logic blocks, input/output buffers, memory blocks, and clock management circuits, allowing for versatile and customizable digital circuit designs. -
Manufacturer
The manufacturer of the XC4VFX20-10FF672C is Xilinx Inc. It is an American technology company that specializes in the development and production of programmable logic devices, such as field-programmable gate arrays (FPGAs) and system on chips (SoCs). -
Application Field
The XC4VFX20-10FF672C is an FPGA that is commonly used in various applications such as video processing, high-speed networking, telecommunications, aerospace, and defense. It is designed to handle complex tasks and perform at high speeds, making it suitable for applications that require high-performance and reliable processing capabilities. -
Package
The XC4VFX20-10FF672C chip has a package type of flip chip ball grid array, a form of 672 pin columns, and a size of 28x28 millimeters.
Datasheet PDF
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