Xilinx XC3S400AN-4FGG400I
High performance CMOS device with 667MHz speed and 8064-Cell capacity
Brands: Amd
Mfr.Part #: XC3S400AN-4FGG400I
Datasheet: XC3S400AN-4FGG400I Datasheet (PDF)
Package/Case: FBGA-400
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2949 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC3S400AN-4FGG400I General Description
The XC3S400AN-4FGG400I is a member of the Spartan-3AN FPGA family from Xilinx. It features a total of 400,000 system gates, making it a mid-range FPGA suitable for a variety of applications. This device is designed to provide high performance, low power consumption, and increased system integration capabilities.The XC3S400AN-4FGG400I operates at a maximum speed of 400 MHz and offers up to 832 user I/O pins, allowing for versatile connectivity options. It is equipped with 64 user I/O banks and supports multiple I/O standards, including LVCMOS, LVTTL, HSTL, and SSTL.This FPGA also includes multiple built-in features to enhance functionality and ease of use, such as integrated block RAM, digital clock managers, and DLLs for precise timing control. It offers a power-efficient design, with standby power consumption as low as 100 mW.The XC3S400AN-4FGG400I comes in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for surface-mount assembly. It operates with a supply voltage of 1.2V and is compatible with industry-standard design tools such as the Xilinx ISE Design Suite.
Features
- 400K system gates
- 6480 logic slices
- 400 I/O pins
- 18 configurable I/O standards
- Up to 864 Mbps data transfer rate
- 4 Input digital clock manager
- Programmable power supplies
- 14-bit DLLs for clock deskew
- 1.2V core voltage
Application
- Telecommunications: The XC3S400AN-4FGG400I can be used in networking equipment, such as routers and switches, to handle data processing tasks efficiently.
- Automotive: It can be used in automotive systems for functions like engine control, driver assistance, and infotainment systems.
- Industrial: The FPGA can be utilized in industrial automation, robotics, and control systems to enhance their performance and flexibility.
- Consumer Electronics: It can be integrated into various consumer devices like gaming consoles, smart TVs, and set-top boxes for improved functionality.
- Medical: The FPGA can be applied in medical imaging, diagnostics, and monitoring systems for faster image processing and analysis.
Specifications
Parameter | Value | Parameter | Value |
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Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
Series | XC3S400AN | Number of Logic Elements | 8064 LE |
Adaptive Logic Modules - ALMs | 3584 ALM | Embedded Memory | 360 kbit |
Number of I/Os | 311 I/O | Supply Voltage - Min | 1.14 V |
Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | - 40 C |
Maximum Operating Temperature | + 100 C | Mounting Style | SMD/SMT |
Package / Case | FBGA-400 | Brand | AMD / Xilinx |
Distributed RAM | 56 kbit | Embedded Block RAM - EBR | 360 kbit |
Maximum Operating Frequency | 250 MHz | Moisture Sensitive | Yes |
Number of Gates | 400000 | Operating Supply Voltage | 1 V |
Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
Subcategory | Programmable Logic ICs | Tradename | Spartan |
Unit Weight | 0.640857 oz |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
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2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S400AN-4FGG400I chip is a field-programmable gate array (FPGA) produced by Xilinx. It is part of the Spartan-3AN FPGA family and features 400,000 system gates. The chip offers a wide range of applications due to its programmable nature, allowing users to configure its logic and functions according to their specific needs. It is commonly used in industries such as aerospace, automotive, and telecommunications.
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Equivalent
Some equivalent products to the XC3S400AN-4FGG400I chip are the Xilinx XC3S400AN-4FTG256C, Xilinx XC3S400AN-4FTG256I, and Xilinx XC3S400AN-5FGG400C. -
Features
The XC3S400AN-4FGG400I is a Spartan-3AN FPGA from Xilinx with 400K system gates, 432 user I/Os, and 10 differential signal pairs. It operates on a supply voltage of 1.2V and supports various features such as embedded RAM, DSP blocks, and clock management circuits. -
Pinout
The XC3S400AN-4FGG400I is a Field-Programmable Gate Array (FPGA) with a 400-pin count. It is capable of performing a wide range of digital functions, such as logic operations, data processing, and memory storage. -
Manufacturer
The manufacturer of the XC3S400AN-4FGG400I is Xilinx Inc. They are a leading American technology company specializing in FPGA (Field-Programmable Gate Array) and SoC (System on a Chip) solutions. Xilinx provides programmable platforms and software tools for various industries, including aerospace, automotive, telecommunications, and more. -
Application Field
The XC3S400AN-4FGG400I is a Field Programmable Gate Array (FPGA) device. It can be used in various application areas, including telecommunications, automotive, industrial control systems, medical devices, and consumer electronics. It offers flexible and customizable digital logic solutions in these domains, enabling designers to implement a wide range of functionalities in their products. -
Package
The XC3S400AN-4FGG400I chip comes in a FBGA (Fine-pitch Ball Grid Array) package type. Its form is a BGA (Ball Grid Array), and the size of the package is 400-ball, measuring 17 x 17 mm.
Datasheet PDF
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