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Xilinx XC3S250E-4FTG256C
572MHz operating frequency, 5508-cell capacity
Brands: Amd
Mfr.Part #: XC3S250E-4FTG256C
Datasheet: XC3S250E-4FTG256C Datasheet (PDF)
Package/Case: FBGA-256
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2517 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC3S250E-4FTG256C General Description
The XC3S250E-4FTG256C is an FPGA (Field-Programmable Gate Array) manufactured by Xilinx. It belongs to the Spartan-3E family and features 250,000 system gates. The "4FTG256C" designation specifies its speed grade and package type. The "4" indicates it operates at a maximum frequency of 4 MHz, while "FTG256C" denotes a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.This FPGA offers versatile programmable logic capabilities, enabling users to implement custom digital circuits and algorithms. Its 250,000 system gates provide ample resources for various applications, including embedded systems, digital signal processing, and communications. The 4 MHz speed grade ensures efficient performance in real-time applications, while the FBGA package offers high-density pin connections for robust integration onto printed circuit boards.
Features
- 250,000 system gates
- 256-ball FTGBA package
- 4ns clock-to-out performance
- Low-power design
- High-capacity configuration
- Advanced system-level power management
- Enhanced system-level features
- Multiple banks of SelectIO™ and logic resources
- Flexible connectivity options
- Excellent reliability and performance
Application
- Industrial automation
- Communications
- Computer and data storage
- Consumer electronics
- Medical devices
- Defense and aerospace
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC3S250E | Number of Logic Elements | 5508 LE |
| Adaptive Logic Modules - ALMs | 2448 ALM | Embedded Memory | 216 kbit |
| Number of I/Os | 172 I/O | Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | + 85 C | Mounting Style | SMD/SMT |
| Package / Case | FBGA-256 | Brand | AMD / Xilinx |
| Distributed RAM | 38 kbit | Embedded Block RAM - EBR | 216 kbit |
| Maximum Operating Frequency | 300 MHz | Moisture Sensitive | Yes |
| Number of Gates | 250000 | Operating Supply Voltage | 1.2 V |
| Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
| Subcategory | Programmable Logic ICs | Tradename | Spartan |
| Unit Weight | 1.281639 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S250E-4FTG256C chip is part of the Xilinx Spartan-3E FPGA family. It features 250,000 system gates, designed for low-power and high-performance applications. It comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at 1.2V. With its flexible programmable logic and numerous I/O options, the chip can be used in a wide range of applications including telecommunications, automotive, industrial, and consumer electronics.
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Features
XC3S250E-4FTG256C is a field-programmable gate array (FPGA) with 250,000 system gates, 500Kb of block RAM, and 86 user I/O pins. It operates at a maximum speed of 400MHz, has 154 system-level interconnects, and includes built-in features like phase-locked loops (PLLs), digital clock managers (DCMs), and on-chip memory. -
Pinout
The XC3S250E-4FTG256C is a Field-Programmable Gate Array (FPGA) with a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It has 250 input/output pins (count includes dedicated input/output, clock, and power pins) and is capable of executing various digital logic functions as defined by the user. -
Manufacturer
Xilinx Inc. is the manufacturer of the XC3S250E-4FTG256C. It is a technology company specializing in programmable logic devices and is considered one of the leading providers of these devices globally. -
Application Field
The XC3S250E-4FTG256C is commonly used in applications such as communication equipment, industrial automation, aerospace and defense systems, and medical devices. It offers a high level of flexibility and can be programmed to suit various functions and requirements. -
Package
The XC3S250E-4FTG256C chip is available in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package type. Its form factor is Quad Flat No-Lead (QFN), and it has a size of 15x15 mm.
Datasheet PDF
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