Xilinx XC3S1600E-4FGG400C
600000 Gate FPGA with a clock speed of 572MHz
Brands: Amd
Mfr.Part #: XC3S1600E-4FGG400C
Datasheet: XC3S1600E-4FGG400C Datasheet (PDF)
Package/Case: FBGA-400
RoHS Status:
Stock Condition: 3824 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
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1 | $691.009 | $691.009 |
180 | $275.718 | $49629.240 |
480 | $266.504 | $127921.920 |
1020 | $261.952 | $267191.040 |
In Stock:3824 PCS
XC3S1600E-4FGG400C General Description
The XC3S1600E-4FGG400C is a member of the Xilinx Spartan-3E FPGA family, designed for high-performance, low-power applications. It features 1.6 million system gates, 376 I/O pins, and 168 user I/O pins. The device operates at a maximum frequency of 400 MHz and is packaged in a 400-pin Fine-Pitch Ball Grid Array (FBGA).The XC3S1600E-4FGG400C offers various built-in features that enhance its functionality, including integrated PowerPC hard blocks and embedded multipliers. It also includes 18 x 18-bit multipliers, 4 DLLs, and 2 DCMs. The device supports configuration over a JTAG interface and has an integrated IEEE 1149.1 (JTAG) test access port.The Spartan-3E FPGA family is known for its low power consumption, making it suitable for battery-operated devices and other power-sensitive applications. It also offers high-speed performance and reliability, making it a popular choice for a wide range of applications in industries such as communications, automotive, consumer electronics, and industrial control.
Features
- Manufacturer: Xilinx
- Series: Spartan-3E
- Logic Elements: 1,200,000
- Number of Logic Cells: 76,800
- Number of I/Os: 381
- Operating Frequency: 450 MHz
Application
- Telecommunications
- Networking equipment
- Industrial control systems
- Automotive applications
- Medical devices
- Consumer electronics
- Security systems
- Military and aerospace applications
- Data storage
- Vision systems
Specifications
Parameter | Value | Parameter | Value |
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Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
Series | XC3S1600E | Number of Logic Elements | 33192 LE |
Number of I/Os | 304 I/O | Supply Voltage - Min | 1.2 V |
Supply Voltage - Max | 1.2 V | Minimum Operating Temperature | 0 C |
Maximum Operating Temperature | + 85 C | Data Rate | 333 Mb/s |
Mounting Style | SMD/SMT | Package / Case | FBGA-400 |
Brand | AMD / Xilinx | Distributed RAM | 231 kbit |
Embedded Block RAM - EBR | 648 kbit | Maximum Operating Frequency | 300 MHz |
Moisture Sensitive | Yes | Number of Gates | 1600000 |
Operating Supply Voltage | 1.2 V | Product Type | FPGA - Field Programmable Gate Array |
Factory Pack Quantity | 1 | Subcategory | Programmable Logic ICs |
Tradename | Spartan |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S1600E-4FGG400C chip is a field-programmable gate array (FPGA) made by Xilinx. It belongs to the Spartan-3E FPGA family and offers 1.6 million system gates, 1536 logic cells, and 40,960 bits of block RAM. It operates at a maximum speed of 400 MHz and is mounted on a 400-ball fine-pitch ball grid array (FBGA) package. The XC3S1600E-4FGG400C is commonly used in various electronic applications requiring high-speed processing and programmability.
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Equivalent
There are no directly equivalent products to the XC3S1600E-4FGG400C chip. However, other Xilinx Spartan-3E FPGA chips with similar characteristics may be considered for similar applications, such as the XC3S1600E-4FGG320C or the XC3S200E-4FGG320C. -
Features
The XC3S1600E-4FGG400C is a field-programmable gate array (FPGA) with 1,576 slices, 98,304 logic cells, and 905Kbits of RAM. It offers a maximum of 1.6 million system gates, 800 MHz maximum operating frequency, integrated block RAM, and high-performance serial connectivity. Additionally, it provides ample programmable interconnect resources and is suitable for various applications. -
Pinout
The pin count of the XC3S1600E-4FGG400C is 400. It is an FPGA (Field-Programmable Gate Array) with a capacity of 1,600,000 system gates and 1,084 equivalent logic cells. It is designed to implement digital logic functions and can be reprogrammed to fit specific applications. -
Manufacturer
XC3S1600E-4FGG400C is manufactured by Xilinx. Xilinx is a prominent American technology company specializing in the development and production of programmable logic devices (PLDs), particularly Field-Programmable Gate Arrays (FPGAs). Xilinx is recognized as a leader in the FPGA market and provides innovative solutions for various applications, including telecommunications, automotive, aerospace, and more. -
Application Field
The XC3S1600E-4FGG400C is commonly used in a variety of application areas such as telecommunications, automotive, industrial automation, consumer electronics, and aerospace. It can be used for tasks such as digital signal processing, image and video processing, network communication, and control systems. -
Package
The XC3S1600E-4FGG400C chip is a field-programmable gate array (FPGA) with a FBGA package type. Its form is BGA (Ball Grid Array) and it has a size of 400 balls.
Datasheet PDF
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