Xilinx XC3S1600E-4FGG320C

Part points

• XC3S1600E-4FGG320C is a chip belonging to the Spartan-3E FPGA family. It has a capacity of 1.6 million gates and operates at a frequency of up to 400 MHz. The chip is manufactured by Xilinx and features a field-programmable gate array (FPGA) architecture. It is commonly used in various industries for applications requiring high-performance programmable logic devices.

• Equivalent

  The equivalent products of the XC3S1600E-4FGG320C chip include XC3S1600E-4FGG320I and XC3S1600E-4FGG320M.

• Features

  XC3S1600E-4FGG320C is a field-programmable gate array (FPGA) with a capacity of 1.6 million system gates. It operates on a 1.2V core voltage and offers 320 I/O pins. It has an advanced architecture, low power consumption, and supports high-speed data transmission. Additionally, it features embedded RAM, DSP blocks, and can be programmed using the Xilinx ISE Design Suite software.

• Pinout

  The XC3S1600E-4FGG320C is a FPGA (Field Programmable Gate Array) with a pin count of 320. It offers 1.6 million system gates, 20,160 logic cells, 576 Kbits of block RAM, and 36 DSP48A1 slices. The specific functions and pin assignment depend on the specific configuration and programming of the device.

• Manufacturer

  The manufacturer of the XC3S1600E-4FGG320C is Xilinx Inc. It is a leading American technology company specializing in the development of programmable logic devices and software tools for FPGA (Field-Programmable Gate Array) technologies.

• Application Field

  The XC3S1600E-4FGG320C is an FPGA (Field Programmable Gate Array) device commonly used in various applications such as communications, industrial automation, aerospace, and defense systems. Its high capacity and flexibility make it suitable for designing complex digital circuits, signal processing, and data acquisition systems.

• Package

  The XC3S1600E-4FGG320C chip has a package type of BGA (Ball Grid Array), a form factor of 29 mm x 29 mm, and a size of 320 pins.